Thermal conductive polymer composites have broad application prospects in the field of thermal management. However, due to intrinsically low thermal conductivity of polymers, even if fillers with high mass fraction are filled, the thermal conductivity of polymer composites cannot be significantly improved. In this paper, bimodal diamond particles (70 wt.% 150 μm and 22 wt.% 25 μm) were incorporated into phenolic resin to construct continuous heat transfer pathways by close packing, thereby enhancing its thermal conductivity. The results indicated that diamond particles with smaller particle size can effectively bridge the gaps between larger ones, forming a continuous for heat conduction. As a result, a maximum thermal conductivity value of 12.45 W/(m·K) can be achieved, which is 65.5 times, 9.8 times and 8.4 times higher than pure phenolic resin, 25 μm diamond particles reinforced phenolic resin composite and 150 μm diamond particles reinforced phenolic resin composite, respectively. Furthermore, heat dissipation and water cooling experiments also confirm the superior heat dissipation performance of phenolic resin composites reinforced with bimodal diamond particles. When the heating voltage is 10 V and the water cooling rate is 30 mL/min, the upper surface temperature of bimodal diamond composites is 129.2°C lower than that of pure phenolic resin. This investigation provides a new type of polymer composite with high thermal conductivity, which has promising prospects for application in thermal management. It also provides new insights for preparing polymer composites with high thermal conductivity by close packing of bimodal particles.Highlights
Surface modification of the filler enhances its combination with resin.
The interfacial bonding will be enhanced by D–OH bond on diamond surface.
Bimodal diamond particles lead to the formation of a closely packed structure.
This special structure can form a three‐dimensional heat conduction network.
The highest TC of the DD/PR composite is 12.45 W/(m·K).
