2023
DOI: 10.1039/d3nr01930f
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Synaptic plasticity and non-volatile memory characteristics in TiN-nanocrystal-embedded 3D vertical memristor-based synapses for neuromorphic systems

Abstract: Although vertical configurations for high-density storage require challenging process steps, such as etching high aspect ratios and atomic layer deposition (ALD), they are more affordable with a relatively simple lithography...

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Cited by 9 publications
(1 citation statement)
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References 78 publications
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“…Among them, RRAM is one of the most promising candidates for application in neuromorphic computing owing to its high scalability, low-power consumption, increased switching speed, and high-switching versatility. Various materials such as metal-oxide, organic, and two-dimensional (2D) are being investigated for applications in neuromorphic systems to emulate synaptic functions. In particular, the conductive bridge random access memory (CBRAM), a type of RRAM with a Ag or Cu electrode, has attracted attention owing to the capability of the CBRAM to implement synaptic functions via short- and long-term memory mechanisms based on active metal-ion transitions. However, active metals have high reactivity and atomic mobility, thus causing diffusion through an insulator or oxidization. These problems result in device performance degradation; consequently, the active metal is not a fab-friendly material in the semiconductor industry.…”
Section: Introductionmentioning
confidence: 99%
“…Among them, RRAM is one of the most promising candidates for application in neuromorphic computing owing to its high scalability, low-power consumption, increased switching speed, and high-switching versatility. Various materials such as metal-oxide, organic, and two-dimensional (2D) are being investigated for applications in neuromorphic systems to emulate synaptic functions. In particular, the conductive bridge random access memory (CBRAM), a type of RRAM with a Ag or Cu electrode, has attracted attention owing to the capability of the CBRAM to implement synaptic functions via short- and long-term memory mechanisms based on active metal-ion transitions. However, active metals have high reactivity and atomic mobility, thus causing diffusion through an insulator or oxidization. These problems result in device performance degradation; consequently, the active metal is not a fab-friendly material in the semiconductor industry.…”
Section: Introductionmentioning
confidence: 99%