“…Despite a di-electric layer that passivates the rear side of a silicon passivated emitter and rear cell devices, recombination at the interface between the metal and silicon still occurs. 6,7 In industrial PERC devices, which possess a performance of 22.21%, the current density of the recombination at the rear metal contact has been measured at 660 fA cm −2 . 8,9 Moreover, the contact geometry on the rear side of the PERC design, which is locally patterned, introduces 3D charge carrier transport.…”