Sustainable Dielectric Films with Ultralow Permittivity from Soluble Fluorinated Polyimide

Li, Hejian; Kong, Xiangyi; Wang, Shixiao; Gong, Min; Lin, Xiang; Zhang, Liang; Wang, Dongrui

doi:10.3390/molecules28073095

Cited by 4 publications

(2 citation statements)

References 47 publications

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“…Hexagonal boron nitride ( h -BN) powders (>99.0%) were purchased from Dandong Rijin Science & Technology, China. Soluble polyimide (sPI) was synthesized from 4,4′-(hexafluoroisopropylidene)diphthalic anhydride (6FDA, >98.0%) and 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane (BAPOFP, >98.0%) following a previous report . The synthesized sPI showed a M n of 89,000 according to gel permeation chromatography (GPC, polystyrene as the standard), and its raw cost was estimated to be ca.…”

Section: Methodsmentioning

confidence: 99%

Polyphenol-Functionalized Boron Nitride Nanosheet-Reinforced Sustainable Polyimide Dielectric Films for Antenna-in-Package Applications

Li,

Wang,

Kong

et al. 2024

ACS Appl. Electron. Mater.

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Polyimide (PI) nanocomposite films containing two-dimensional boron nitride nanosheets (BNNSs) have been recognized as advanced dielectrics for flexible and miniaturized integrated circuits and communication electronics. However, highquality BNNSs must be created using lengthy and sophisticated exfoliation and surface functionalization methods, while a PI matrix often undergoes high-temperature imidization, which results in thermosetting properties. These factors pose significant challenges for the manufacture and application of BNNSs/PI dielectrics. Herein, we report a simple yet effective approach to fabricate sustainable BNNSs/PI dielectric films using polyphenol-functionalized BNNSs as the filler and soluble PI (sPI) as the matrix. BNNSs with average size of 2.5 μm in lateral dimension and 2.7 nm in thickness were prepared through a lithium intercalation-assisted liquid-phase exfoliation method. The BNNSs were further modified with polyphenol compounds via noncovalent functionalization. We investigated four different polyphenols, namely, hydroquinone (HQ), dopamine (DP), tannic acid (TA), and tea polyphenol (TP), and found that TP displays a high functionalization density of 0.699 molecule/nm 2 on surfaces of BNNSs, which is about 1 order of magnitude larger than that of TA. Accordingly, TP-BNNSs/ sPI nanocomposites demonstrate superior properties, including a dielectric constant of 3.08 and loss tangent of 0.006 at 100 kHz, electrical breakdown strength of 185.4 kV/mm, and tensile strength of 87 MPa under the filler loading of 1 wt %. Furthermore, the TP-BNNSs/sPI nanocomposite films can be simply recycled at least four times without losing performance. We also demonstrate a coplanar waveguide antenna with the TP-BNNSs/sPI nanocomposite as the dielectric layer, confirming its great potential for practical applications.

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Section: Methodsmentioning

confidence: 99%

Polyphenol-Functionalized Boron Nitride Nanosheet-Reinforced Sustainable Polyimide Dielectric Films for Antenna-in-Package Applications

Li,

Wang,

Kong

et al. 2024

ACS Appl. Electron. Mater.

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“…The dielectric constant of PI fibers was substantially cut down from 3.0 to 2.48 at 10 GHz after the introduction of –CF 3 groups. Li et al [ 23 ] manufactured a series of porous low k PI films through the nonsolvent-induced phase separation of a soluble FPI. By adjusting the mass ratio of the binary solvent used to dissolve the PI, the structure could be regulated accurately and the PI film with a porosity of 48% displayed a low dielectric constant of 2.48 at 10 GHz.…”

Section: Methods For Reducing the Dielectric Constant Of Pimentioning

confidence: 99%

Research Advances of Porous Polyimide—Based Composites with Low Dielectric Constant

et al. 2023

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With the burgeoning of the microelectronics industry, in order to improve the transmission speed between chips in large-scale integrated circuits to meet the demands of high integration, it is necessary for interlayer insulation materials to possess a lower dielectric constant (k). Polyimide (PI) has been widely used as interlayer insulation materials for large-scale integrated circuits, and the exploration on reducing their dielectric constant has attracted extensive attention in recent years. In this work, porous PI-based composites with a low dielectric constant are mainly reviewed. The application of porous SiO2, graphene derivatives, polyoxometalates, polyhedral oligomeric silsesquioxane and hyperbranched polysiloxane in reducing the dielectric constant of PI is emphatically introduced. The key technical problems and challenges in the current research of porous polyimide materials are summarized, and the development prospect of low k polyimide is also expounded.

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High-frequency low-dielectric-loss in linear-backbone-structured polyimides with ester groups and ether bonds

Zhang,

He,

2024

Commun Mater

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Polyimides have emerged as promising dielectric materials for communication equipment, owing to their excellent thermal stability and processability. Nonetheless, a pressing need remains to reduce the high-frequency dissipation factor (Df) of polyimides. Here, we synthesized various polyimides featuring linear backbone structures, finding that polyimides that incorporate a combination of ester groups and ether bonds exhibit low Df values of 0.0015-0.0024 at 10 GHz. Even in high humidity and temperature conditions they maintain low Df values of <0.005 at 10 GHz. To gain insight into the factors influencing this behavior, we conduct a comprehensive study involving aggregation structures and hygroscopic properties. Our findings highlight the pivotal role of high orientation and crystallinity in determining the high-frequency Df of polyimide films.

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Sustainable Dielectric Films with Ultralow Permittivity from Soluble Fluorinated Polyimide

Cited by 4 publications

References 47 publications

Polyphenol-Functionalized Boron Nitride Nanosheet-Reinforced Sustainable Polyimide Dielectric Films for Antenna-in-Package Applications

Polyphenol-Functionalized Boron Nitride Nanosheet-Reinforced Sustainable Polyimide Dielectric Films for Antenna-in-Package Applications

Research Advances of Porous Polyimide—Based Composites with Low Dielectric Constant

High-frequency low-dielectric-loss in linear-backbone-structured polyimides with ester groups and ether bonds

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