Survey of High-Temperature Reliability of Power Electronics Packaging Components

A Review of SiC Power Module Packaging: Layout, Material System and Integration

“…Silicone gels belongs to this kind of polymers and are widely retained for encapsulating high voltage multi-chip power assemblies, due to their very high softness and high insulating electrical properties. However, the literature review shows that high temperature commercially available silicone gels exhibit a maximum temperature limit lower than 250 °C for continuous service of operation [57], [106]. The review also reveals that a trade-off between high temperature ability and softness of silicones generally exists.…”

High temperature ageing of microelectronics assemblies with SAC solder joints

“…They require specific assembly technologies, such as ceramic substrates, high temperature solders, etc. In particular, component attaches rely either on gold-based solder alloys, or on silver sintering [3,4]. This paper focuses on temperatures ranges up to 175°C, where it is desirable and conceivable to use more standard technologies such as PCBs and lead-free solders.…”

Review of State-of-the-Art Integration Technologies in Power Electronic Systems

“…In DBC ceramic substrates, Al 2 O 3 , AlN, BeO and Si 3 N 4 can be used as the insulating materials [51]. Though BeO has the highest thermal conductive performance, it is not commonly used because the particle generated during the processing is harmful to human health.…”