2020 IEEE Aerospace Conference 2020
DOI: 10.1109/aero47225.2020.9172807
|View full text |Cite
|
Sign up to set email alerts
|

Survey of Cryogenic Power Electronics for Hybrid Electric Aircraft Applications

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1
1

Citation Types

0
3
0

Year Published

2021
2021
2023
2023

Publication Types

Select...
5
1

Relationship

0
6

Authors

Journals

citations
Cited by 17 publications
(3 citation statements)
references
References 22 publications
0
3
0
Order By: Relevance
“…Existing research has already demonstrated the feasibility and potential of cryogenic power electronics. This information is further reinforced by the results of the latest paper ([8], [9], [10], [11]) according to which the main power components (power modules, bus bars, passive components...) have better performance at lower temperatures, thus increasing the overall efficiency and power density of cryogenic power converters.…”
Section: Power Electronicsmentioning
confidence: 90%
“…Existing research has already demonstrated the feasibility and potential of cryogenic power electronics. This information is further reinforced by the results of the latest paper ([8], [9], [10], [11]) according to which the main power components (power modules, bus bars, passive components...) have better performance at lower temperatures, thus increasing the overall efficiency and power density of cryogenic power converters.…”
Section: Power Electronicsmentioning
confidence: 90%
“…17). From an application perspective, the ability of power electronics to operate at cryogenic temperatures are desirable for weight sensitive transport applications such as shipping [280] and aircraft [281]. The emergence of reliable power devices which can operate at cryogenic temperature is especially important for aeronautics and space power systems where temperature extremes to below -200 °C [282] can be expected over the operating life of deep space missions.…”
Section: Extreme Temperature Robustnessmentioning
confidence: 99%
“…Unlike power switching operation at high temperatures, silicon carbide (SiC) proves to be an inferior counterpart in cryogenic converter applications. On the contrary, gallium nitride (GaN) switches offer superior characteristics in terms of desired electrical properties for a power converter as found in the literatures [1][2]. Although GaN devices are entitled to better figure-of-merit (FOM), the lack of available high voltage (HV) devices can limit the possibility of its high-power applications.…”
Section: Introductionmentioning
confidence: 99%