Surfactant controlled interfacial alloying in thermally evaporated Cu/Co multilayers

Amir, S. M.; Gupta, Mukul; Gupta, Ajay

doi:10.1016/j.jallcom.2011.12.053

Cited by 14 publications

(14 citation statements)

References 42 publications

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“…Several other surfactant elements such as Bi, [26][27][28][29][30] Ag, [31][32][33][34][35] Au 36 and In 37 have been similarly found to induce layer quality improvement for physically deposited multilayers.…”

Section: D332mentioning

confidence: 99%

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Influence of Ag Additive to the Spacer Layer on the Structure and Giant Magnetoresistance of Electrodeposited Co/Cu Multilayers

Neuróhr

Péter

Pogány

et al. 2015

J. Electrochem. Soc.

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In order to explore the possible surfactant effect of Ag on the formation of electrodeposited multilayers, Co/Cu(Ag) multilayers were prepared by this technique and their structure and giant magnetoresistance (GMR) were investigated. The multilayers were deposited from a perchlorate bath with various amounts of Ag + ions in the solution for incorporating Ag atoms into the multilayer stack. Without Ag addition, secondary neutral mass spectroscopy (SNMS) indicated a well-defined composition modulation of the undermost Co/Cu bilayers. However, already at an Ag content as low as 1.8 at.% incorporated, SNMS showed a deterioration of the periodic multilayer structure. In agreement with the SNMS results, superlattice satellites were visible in the X-ray diffraction (XRD) patterns of the multilayers with up to 0.3 at.% Ag. The satellites were, however, very faint even for multilayers without Ag addition, indicating that the multilayers have high interface roughness and/or poor periodicity. In the absence of Ag and at the smallest Ag content investigated by XRD, a strong central multilayer peak and the weak superlattice satellites were complemented by weak diffraction maxima from non-periodic Co and Cu domains. In the Co/Cu(Ag) multilayer containing about 25 at.% Ag, i.e., nearly as much as Cu, XRD found a separate Ag(Cu) phase. In spite of the imperfect layered structure, a multilayer-type GMR behavior was observed in all samples up to about 10 at.% Ag incorporated in the multilayer stack. The GMR magnitude increased for Ag contents up to about 1 at.%, which implies that a small amount of Ag may have a beneficial effect through a slight modification of the layer growth and/or interface formation. However, for higher Ag contents beyond this level, the GMR was reduced in line with the structural degradation revealed by XRD and SNMS. For the highest Ag contents (above about 10 at.%), the GMR exhibited a behavior characteristic of a granular magnetic alloy, in agreement with the results of the structural study. One of the major obstacles hindering the realization of a high giant magnetoresistance (GMR) in electrodeposited (ED) ferromagnetic/non-magnetic (FM/NM) multilayers is that the nonmagnetic spacer layer cannot be electrodeposited as pinhole-free for layer thicknesses which are required to achieve high GMR and an oscillatory GMR behavior. 1 Sputtered Co/Cu multilayers 2-4 exhibit an oscillatory GMR and a room-temperature GMR of about 50% and 20% at about 1 and 2 nm Cu layer thicknesses, respectively. At these particular spacer thicknesses, a strong antiferromagnetic (AF) exchange coupling exists between the adjacent magnetic layers. It gives rise then to a large GMR effect since the AF coupling ensures an antiparallel alignment of the magnetizations of the neighboring magnetic layers in zero magnetic field. For spacer thicknesses between these so-called AF maxima, the exchange coupling is predominantly ferromagnetic. Thus, due to the parallel alignment of the layer magnetizations even in zero magnetic field, no GMR eff...

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Section: D332mentioning

confidence: 99%

“…[31][32][33][34] The growth mechanisms induced by Ag as a surfactant in GMR multilayers were investigated by An et al 35 by using interface-sensitive X-ray anomalous scattering techniques. These results also suggested that the addition of Ag during deposition suppresses interfacial intermixing.…”

Section: D332mentioning

confidence: 99%

Influence of Ag Additive to the Spacer Layer on the Structure and Giant Magnetoresistance of Electrodeposited Co/Cu Multilayers

Neuróhr

Péter

Pogány

et al. 2015

J. Electrochem. Soc.

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“…Many multilayer systems were studied; among others Co/Cu and Co/Au alloys and multilayer thin films have been intensively studied [8][9][10]. Chado et al [10] studied the deposition of small clusters of Co on gold surfaces with regular defects.…”

Section: Introductionmentioning

confidence: 99%

“…They concluded that the lattice mismatch between Au and Co is strong enough to stress storage from the early stages of growth, and the Co lattice relaxes to its bulk value. Amir et al [8] observed that addition of Ag surfactant in Cu/Co multilayers results in smoother and symmetrical interfaces and inhibits the interfacial alloying across the interfaces in Cu/Co multilayers. Without surfactant, they observed the metastable Cu/Co phases grow at the interfaces.…”

Section: Introductionmentioning

confidence: 99%

Stress induced grain boundaries in thin Co layer deposited on Au and Cu

Zientarski

Chocyk

2016

Appl. Phys. A

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In this work, the structure and stress evolution in Co/Au and Co/Cu two-layer systems during deposition were studied. The growth of this system is evaluated by employing molecular dynamic simulations with potentials based on the embedded atom method theory. We used the kinematical scattering theory and the Ackland-Jones bondangle method to the structural characterisation of deposited layers. In both systems, only compressive stress is observed during the deposition process and process relaxation of stress is visible. In Co/Au systems, creation of grains and grain boundaries is observed.

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“…[22][23][24] Introduction of third element known as surfactant minimizes the difference of the c of the elements and induce layer by layer growth. [24][25][26][27][28][29][30] Various types of surfactants, e.g., Ag (c ¼ 1.2 J/m 2 ), Sb(c ¼ 0.6 J/m 2 ), Bi(c ¼ 0.6 J/m 2 ), Pb (c ¼ 0.6 J/m 2 ), etc. (c alues for polycrystalline case) have been used in different types of multilayers.…”

Section: Introductionmentioning

confidence: 99%

Study of surfactant mediated growth of Ni/V superlattices

Amir

Gupta

Potdar

et al. 2013

Journal of Applied Physics

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The Ni/V multilayers are useful as soft x-ray mirrors, polarizers, and phase retarders. For these applications, it is necessary that the interfaces roughness and interdiffusion must be as small as possible. The V-on-Ni and Ni-on-V interfaces are asymmetric due to the difference in the surface free energy of Ni and V. In this work, we report Ag surfactant mediated growth of Ni/V superlattices prepared using ion beam sputter deposition technique. These superlattices were studied using x-ray and neutron scattering techniques. It was found that when added in an optimum amount, Ag surfactant results in reduced interface roughness and interdiffusion across the interfaces. Obtained results can be understood with the surfactant floating-off mechanism leading to a balance in the surface free energy of Ni and V. V

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Surfactant controlled interfacial alloying in thermally evaporated Cu/Co multilayers

Cited by 14 publications

References 42 publications

Influence of Ag Additive to the Spacer Layer on the Structure and Giant Magnetoresistance of Electrodeposited Co/Cu Multilayers

Influence of Ag Additive to the Spacer Layer on the Structure and Giant Magnetoresistance of Electrodeposited Co/Cu Multilayers

Stress induced grain boundaries in thin Co layer deposited on Au and Cu

Study of surfactant mediated growth of Ni/V superlattices

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