Surface treatment by crystalline Co-P coating with ultra-thin CoTe2 layer for improved electrical and mechanical properties of the n-type Bi2Te3/Sn TEG electrode

Liu, Shuang; Ma, Limin; Zhen, Cheng; Li, Dan; Wang, Yishu; Jia, Qiang; Guo, Fu

doi:10.1016/j.apsusc.2023.158856

Cited by 1 publication

(1 citation statement)

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“…Electroless nickel/immersion gold (ENIG) and electroless nickel/electroless palladium/immersion gold (ENEPIG) are commonly used surface finishing processes for the diffusion barrier. In addition to Ni, Co is also frequently studied and recommended as a promising diffusion barrier material because it provides a stable interface [16][17][18].…”

Section: Introductionmentioning

confidence: 99%

Interfacial Reactions between Sn-Based Solders and n-Type Bi2(Te,Se)3 Thermoelectric Material

Wang,

Chiu,

2024

Materials

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This study investigated the interfacial reactions between n-type Bi2(Te,Se)3 thermoelectric material, characterized by a highly-oriented (110) plane, and pure Sn and Sn-3.0Ag-0.5Cu (wt.%) solders, respectively. At 250 °C, the liquid-state Sn/Bi2(Te,Se)3 reactions resulted in the formation of both SnTe and BiTe phases, with Bi-rich particles dispersed within the SnTe phase. The growth of the SnTe phase exhibited diffusion-controlled parabolic behavior over time. In contrast, the growth rate was considerably slower compared to that observed with p-type (Bi,Sb)2Te3. Solid-state Sn/Bi2(Te,Se)3 reactions conducted between 160 °C and 200 °C exhibited similar interfacial microstructures. The SnTe phase remained the primary reaction product, embedded with tiny Bi-rich particles, revealing a diffusion-controlled growth. However, the BiTe layer had no significant growth. Further investigation into growth kinetics of intermetallic compounds and microstructural evolution was conducted to elucidate the reaction mechanism. The slower growth rates in Bi2(Te,Se)3, compared to the reactions with (Bi,Sb)2Te3, could be attributed to the strong suppression effect of Se on SnTe growth. Additionally, the interfacial reactions of Bi2(Te,Se)3 with Sn-3.0Ag-0.5Cu were also examined, showing similar growth behavior to those observed with Sn solder. Notably, compared with Ag, Cu tends to diffuse towards the interfacial reaction phases, resulting in a high Cu solubility within the SnTe phase.

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Section: Introductionmentioning

confidence: 99%