Surface stress generation during formation of alkanethiol self-assembled monolayer (SAM)

Shrotriya, Pranav; Karuppiah, K.K.S.; Zhang, R.; Chandra, Abhijit; Sundararajan, Sriram

doi:10.1016/j.mechrescom.2007.09.007

Cited by 4 publications

(2 citation statements)

References 15 publications

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“…On the other hand, it has been reported that the self-assembly process can change the surface stress[9], which can be measured by a micro-cantilever system[10]. It is, however, still very difficult to study the change of local strain at nanometer scales.…”

Section: Introductionmentioning

confidence: 99%

The effects of strain on STM lithography on HS-ssDNA/Au (111) surface

Chen

Zhou

Yang

2009

Applied Surface Science

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Scanning tunneling microscopy (STM) lithography was utilized to investigate a 12-mer HS-ssDNA self-assembled Au (111) surface. Under low sample bias and high tunneling current, the repeated scanning resulted in the growth of nanostripes. The stripe orientation, the stripe width, and the spacer width between adjacent nanostripes were found to be dependent on their relative locations from dislocation points where two adjacent gold terraces overlap. The stripe and the spacer width also vary with the distance from these points. The results indicate that such stripes may reflect the strain distributions and the release pathway along the Au surfaces. The results also suggest that the presence of HS-ssDNA molecules enhances the lithography processes on the gold surface by acting as force transmitters.

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Section: Introductionmentioning

confidence: 99%

The effects of strain on STM lithography on HS-ssDNA/Au (111) surface

Chen

Zhou

Yang

2009

Applied Surface Science

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“…Principle of curvature measurement is schematically represented in Figure 1 3,4 . The interferometer apparatus consists of a convex lens, a reflecting mirror, and a reflective sample surface arranged such that the sample surface and the mirror are located on the two focal planes of the lens, respectively.…”

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confidence: 99%

Curvature Interferometry based In-Situ Measurement of Stresses Associated with Electrochemical Reactions

Çapraz¹,

Shrotriya²,

Hebert³

2012

Meet. Abstr.

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Anodization1 as well as dissolution2 of reactive metals such as aluminum results in buildup of significant levels of stresses on the reacting surface. In-situ measurement of stress evolution can provide remarkable insights into the associated electrochemical reactions and help in understanding the governing mechanisms. We report a curvature interferometry based technique for in-situ monitoring of stress evolution. Curvature interferometer is incorporated into the electrochemical cell and is used to monitor the curvature changes of the samples in order to determine the stress-thickness product of the film formed on the reacting surface.Abstract #966, 221st ECS Meeting,

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Multiscale Modeling Reveals the Cause of Surface Stress Change on Microcantilevers Due to Alkanethiol SAM Adsorption

Zhao

Gosai

Kang

et al. 2020

J. Chem. Inf. Model.

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Experimental results show that the adsorption of the self assembled monolayers (SAMs) on a gold surface induces surface stress change that cause a deformation of the underlying substrate.However, the exact mechanism of stress development is yet to be elucidated. In the present study, multiscale computational models based on molecular dynamics (MD) simulations are applied to study the mechanism governing surface stress change. Distinct mechanisms for adsorption induced surface deformation, namely inter chain repulsion and thiol-gold interaction driven gold surface reconstruction, are investigated. Two different inter-atomic potentials, embedded atom method (EAM) and surface embedded atom method (SEAM), are used in the MD simulations to study the reconstruction induced surface stresses. Comparison of the predicted surface stress changes, resulting from MD and continuum mechanics based models, with observed experimental response, indicate that a modified SEAM based multiscale model can better capture the surface stress changes observed during alkanethiol SAM formation and gold surface reconstruction is the primary factor behind the surface stress change. Inter chain repulsions of SAM are found to have minimal contribution. Also, both the simulations and experiments show that surface stress change increases with surface coverage density and larger grain size.

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Surface stress generation during formation of alkanethiol self-assembled monolayer (SAM)

Cited by 4 publications

References 15 publications

The effects of strain on STM lithography on HS-ssDNA/Au (111) surface

The effects of strain on STM lithography on HS-ssDNA/Au (111) surface

Curvature Interferometry based In-Situ Measurement of Stresses Associated with Electrochemical Reactions

Multiscale Modeling Reveals the Cause of Surface Stress Change on Microcantilevers Due to Alkanethiol SAM Adsorption

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