Recent
advances in design and processing technology have made possible
commercialization of polycrystalline (px)-CdTe as a photovoltaic absorber.
Grain boundaries (GBs) are the most prominent structural defects in
these devices and undergo significant changes during device fabrication.
However, the effects of device fabrication processes on these GBs
are not entirely understood. Prevailing models of GBs in thin-film
photovoltaics consider individual GBs to have homogeneous properties
in their area. Here, using an aberration-corrected scanning transmission
electron microscope (STEM)-based low-loss and core-loss electron energy-loss
spectroscopy (EELS), we show that back-surface etching of CdTe leads
to inhomogeneity within individual grain boundaries. We observe that
etching the back surface leads to the conversion of a region of GBs
from CdTe to an elemental Te, which has an only 0.33 eV band gap,
as deep as 1 μm from the back surface. The presence of elemental
Te in GBs this deep into the absorber layer will increase recombination
in the absorber layer and limit the extractable open-circuit voltage,
thus reducing device efficiency. However, additive methods for back
contact formation such as deposition of Te, ZnTe, or other materials
preserve the CdTe stoichiometry of the GBs. Thus, especially for the
next generations of CdTe-based cells having longer minority carrier
diffusion length and/or thinner absorber layers, additive back contacting
methods are superior.