Surface quality of {111} side-walls in KOH-etched cavities

Merveille, C.

doi:10.1016/s0924-4247(97)01495-7

Cited by 18 publications

(9 citation statements)

References 9 publications

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“…Very little work has been done to investigate the surface quality of sidewalls, including the potential causes for roughness. Work by Merveille [21] suggests that surface imperfections may originate from mechanical stress in the wafer or precipitation of impurities, such as oxygen, during processing. We continue to work towards better sidewall surface quality.…”

Section: Discussionmentioning

confidence: 99%

Silicon bulk micromachined hybrid dimensional artifact.

Claudet

Tran

Bauer

et al. 2010

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A mesoscale dimensional artifact based on silicon bulk micromachining fabrication has been developed and manufactured with the intention of evaluating the artifact both on a high precision coordinate measuring machine (CMM) and video-probe based measuring systems. This hybrid artifact has features that can be located by both a touch probe and a video probe system with a k=2 uncertainty of 0.4 m, more than twice as good as a glass reference artifact. We also present evidence that this uncertainty could be lowered to as little as 50 nm (k=2).While video-probe based systems are commonly used to inspect mesoscale mechanical components, a video-probe system's certified accuracy is generally much worse than its repeatability. To solve this problem, an artifact has been developed which can be calibrated using a commercially available high-accuracy tactile system and then be used to calibrate typical production vision-based measurement systems. This allows for error mapping to a higher degree of accuracy than is possible with a glass reference artifact.Details of the designed features and manufacturing process of the hybrid dimensional artifact are given and a comparison of the designed features to the measured features of the manufactured artifact is presented and discussed. Measurement results from vision and touch probe systems are compared and evaluated to determine the capability of the manufactured artifact to serve as a calibration tool for video-probe systems. An uncertainty analysis for calibration of the artifact using a CMM is presented. 3 ACKNOWLEDGMENTS

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Section: Discussionmentioning

confidence: 99%

Silicon bulk micromachined hybrid dimensional artifact.

Claudet

Tran

Bauer

et al. 2010

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“…It is the result of chemical reactions between the surface atoms and the etchant phase molecules. Wet etching is a popular process for the creation of microstructures in a wide range of applications, such as pressure sensors [20], gas-flow sensors [21] or micro-switches [22]. In this process, the advancing front propagates with a different rate depending on the crystallographic direction.…”

Section: Physical Model For Wet Etchingmentioning

confidence: 99%

Octree-based, GPU implementation of a continuous cellular automaton for the simulation of complex, evolving surfaces

Ferrando

Gosálvez

Cerdá

et al. 2011

Computer Physics Communications

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Presently, dynamic surface-based models are required to contain increasingly larger numbers of points and to propagate them over longer time periods. For large numbers of surface points, the octree data structure can be used as a balance between low memory occupation and relatively rapid access to the stored data. For evolution rules that depend on neighborhood states, extended simulation periods can be obtained by using simplified atomistic propagation models, such as the Cellular Automata (CA). This method, however, has an intrinsic parallel updating nature and the corresponding simulations are highly inefficient when performed on classical Central Processing Units (CPUs), which are designed for the sequential execution of tasks. In this paper, a series of guidelines is presented for the efficient adaptation of octree-based, CA simulations of complex, evolving surfaces into massively parallel computing hardware. A Graphics Processing Unit (GPU) is used as a cost-efficient example of the parallel architectures. For the actual simulations, we consider the surface propagation during anisotropic wet chemical etching of silicon as a computationally challenging process with a wide-spread use in microengineering applications. A continuous CA model that is intrinsically parallel in nature is used for the time evolution. Our study strongly indicates that parallel computations of dynamically evolving surfaces simulated using CA methods are significantly benefited by the incorporation of octrees as support data structures, substantially decreasing the overall computational time and memory usage.

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“…At lower temperatures, this cutoff moves slightly towards shorter wavelengths (∼1:07 μm at 77 K) [22]. For silicon diffraction gratings that are fabricated using wet etch processes to create the diffracting surfaces, a low oxygen content also reduces the facet roughness [39,40], although it is not clear that the surface roughness of the facets is the dominant scattering process [41].…”

Section: Siliconmentioning

confidence: 99%

Micromachined silicon grisms for infrared optics

et al. 2009

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We demonstrate the successful fabrication of large format (approximately 50 mm × 50 mm) gratings in monolithic silicon for use as high-efficiency grisms at infrared wavelengths. The substrates for the grisms were thick (8-16 mm) disks of precisely oriented single-crystal silicon (refractive index, n ~ 3.42). We used microlithography and chemical wet etching techniques to produce the diffraction gratings on one side of these substrates. These techniques permitted the manufacture of coarse grooves (as few as 7 grooves/mm) with precise control of the blaze angle and groove profile and resulted in excellent groove surface quality. Profilometric measurements of the groove structure of the gratings confirm that the physical dimensions of the final devices closely match their design values. Optical performance of these devices exceeds the specifications required for diffraction-limited performance (RMS wave surface error<λ/20) in the near- and mid-infrared (1-40 μm). Peak diffraction efficiencies measured in the reflection range from 70-95% of the theoretical maximum. Tests of our grisms in the near infrared indicate transmission efficiencies of 30-48% uncorrected for Fresnel losses and confirm excellent performance. In infrared wavelength regions where silicon transmits well, the blaze control and high index permit high-resolution, high-order dispersion in a compact space. The first application of these grisms is to provide FORCAST, a mid-infrared camera on NASA's airborne observatory, with a moderate resolution (R=100-1000) spectroscopic capability.

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Surface quality of {111} side-walls in KOH-etched cavities

Cited by 18 publications

References 9 publications

Silicon bulk micromachined hybrid dimensional artifact.

Silicon bulk micromachined hybrid dimensional artifact.

Octree-based, GPU implementation of a continuous cellular automaton for the simulation of complex, evolving surfaces

Micromachined silicon grisms for infrared optics

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