Surface properties and wetting characteristics of liquid Ag–Bi–Sn alloys

Sklyarchuk, V.; Plevachuk, Yu.; Novaković, R.; Kaban, I.

doi:10.1007/s00706-012-0757-x

Cited by 10 publications

(2 citation statements)

References 23 publications

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“…In this test case, the reservoir, and thus the melted metal, was heated to an elevated temperature of 400 °C. The higher initial temperature results in lower viscosity, density, and surface tension of the Sn-Bi-Ag solder [ 58 ]. The shrinkage of the solder will be slightly higher due to the initial temperature.…”

Section: Resultsmentioning

confidence: 99%

Bulge-Free and Homogeneous Metal Line Jet Printing with StarJet Technology

Straubinger,

Koltay,

Zengerle

et al. 2024

Micromachines

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The technology to jet print metal lines with precise shape fidelity on diverse substrates is gaining higher interest across multiple research fields. It finds applications in additively manufactured flexible electronics, environmentally friendly and sustainable electronics, sensor devices for medical applications, and fabricating electrodes for solar cells. This paper provides an experimental investigation to deepen insights into the non-contact printing of solder lines using StarJet technology, eliminating the need for surface activation, substrate heating, curing, or post-processing. Moreover, it employs bulk metal instead of conventional inks or pastes, leading to cost-effective production and enhanced conductivity. The effect of molten metal temperature, substrate temperature, standoff distance, and printing velocity was investigated on polymer foils (i.e., PET sheets). Robust printing parameters were derived to print uniform, bulge-free, bulk metal lines suitable for additive manufacturing applications. The applicability of the derived parameters was extended to 3D-printed PLA, TPU, PA-GF, and PETG substrates having a much higher surface roughness. Additionally, a high aspect ratio of approx. 16:1 wall structure has been demonstrated by printing multiple metal lines on top of each other. While challenges persist, this study contributes to advancing additively manufactured electronic devices, highlighting the capabilities of StarJet metal jet-printing technology.

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Section: Resultsmentioning

confidence: 99%

Bulge-Free and Homogeneous Metal Line Jet Printing with StarJet Technology

Straubinger,

Koltay,

Zengerle

et al. 2024

Micromachines

View full text Add to dashboard Cite

show abstract

“…For instance, the high melting point lead-free Sn-based interconnect materials may damage the polymer-based substrates having a low glass transition temperature, hot tearing due to the formation of large size Sn dendrites, non-homogeneous distribution of strain, excessive growth of IMC layers and relatively poor wettability as compared to the eutectic SnPb solder alloys [15]. Among the Sn-based lead-free solder alloys, the superior wettability and good mechanical properties of Sn-Bi-Ag based solder alloy, with the melting temperatures close to the eutectic Sn-38Pb solder have been regarded as a possible replacement for the conventional Sn-Pb solder alloy used in electronic packaging systems [16][17][18].…”

Section: Introductionmentioning

confidence: 99%

Interfacial microstructure, wettability and material properties of nickel (Ni) nanoparticle doped tin–bismuth–silver (Sn–Bi–Ag) solder on copper (Cu) substrate

Gain

Zhang

2015

J Mater Sci: Mater Electron

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This paper investigates the influence of adding nickel (Ni) nanoparticles on the microstructure, wettability and material properties of Sn-35Bi-1Ag (wt%) based solders. Material properties such as elastic and shear moduli, stress/strain behavior and electrical resistivity of bulk composite solder were improved significantly in comparison to the corresponding properties of reference solder alloy. The elastic and shear moduli of composite solder increased about 16.8 and 19 % respectively, while the electrical resistivity at room temperature was improved from 23.7 to 25.1 lX cm. On the other hand, in solder joint on Cu substrate, an island-shaped Cu 6 Sn 5 IMC layer was clearly observed at interface for the plain solder/substrate system. Further a prolong reaction, a very thin Cu 3 Sn IMC layer was also formed at the substrate surface. However, in the case of the composite solder/substrate system, a scallop-shaped ternary (Cu, Ni)-Sn IMC layer was observed to be adhered at the interface without formation of Cu 3 Sn IMC layer for the composite solder/substrate system. Moreover, the composite solder/substrate system hindered the growth behavior of IMC layer as well as refined the microstructure which can influence life-span of electronic devices. Additionally, the overall micro-hardness values of composite solder joints exhibited higher values as compare to the plain solder joints due to the second phase strengthening mechanism.

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Effect of Ag nanoparticles on microstructure, damping property and hardness of low melting point eutectic tin–bismuth solder

Gain

Zhang

2017

J Mater Sci: Mater Electron

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Surface properties and wetting characteristics of liquid Ag–Bi–Sn alloys

Cited by 10 publications

References 23 publications

Bulge-Free and Homogeneous Metal Line Jet Printing with StarJet Technology

Bulge-Free and Homogeneous Metal Line Jet Printing with StarJet Technology

Interfacial microstructure, wettability and material properties of nickel (Ni) nanoparticle doped tin–bismuth–silver (Sn–Bi–Ag) solder on copper (Cu) substrate

Effect of Ag nanoparticles on microstructure, damping property and hardness of low melting point eutectic tin–bismuth solder

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