2003
DOI: 10.1016/s0167-9317(02)00898-5
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Surface preparation and interfacial stability of high-k dielectrics deposited by atomic layer chemical vapor deposition

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Cited by 54 publications
(45 citation statements)
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“…Although the analysis of SE measurements is more straightforward for atomically flat substrates, the roughness of NCD and especially UNCD films is low and regular enough to correct for by introducing an additional layer in the optical model, with intermediate optical properties. 49 The H-terminated Si samples were put under the protective atmosphere of a nitrogen filled glovebox, after a short transportation time (~minutes) in air.…”
Section: Introductionmentioning
confidence: 99%
“…Although the analysis of SE measurements is more straightforward for atomically flat substrates, the roughness of NCD and especially UNCD films is low and regular enough to correct for by introducing an additional layer in the optical model, with intermediate optical properties. 49 The H-terminated Si samples were put under the protective atmosphere of a nitrogen filled glovebox, after a short transportation time (~minutes) in air.…”
Section: Introductionmentioning
confidence: 99%
“…We quantify the unpassivated defect density, examine the origin of the Si-db defect, and report on the effects of the pre-deposition nitridation step, which has been shown in a number of dielectrics to improve interface quality above that of ALD grown films on HF-treated substrates, which may result in uneven nucleation and discontinuous films [10]. We also show the effects of post-deposition annealing in forming gas at temperatures from 400 o C to 550 o C.…”
Section: Introductionmentioning
confidence: 99%
“…11 and zirconium oxide on silicon, which show that nitridation of the silicon substrate produces a better quality interface [10,11].…”
Section: Methodsmentioning
confidence: 96%
“…We quantify the unpassivated defect density, examine the origin of the Si-db defect, and report on the effects of a pre-deposition nitridation step -which has been shown in a number of dielectrics to improve interface quality [10,11] above that of ALD grown films on HF-treated substrates, which may result in uneven nucleation and discontinuous films [10,12]. We also show the effects of postdeposition annealing in forming gas.…”
Section: Introductionmentioning
confidence: 99%