Surface Potential Behavior of Direct-Fluorinated PPLP Under Quench Condition

Du, B. X.; Xing, Yunqi; Jin, Jian Xun; Huang, P. H.; Xiao, Meng

doi:10.1109/tasc.2016.2594870

Cited by 8 publications

(8 citation statements)

References 25 publications

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“…For example, silicone rubber, first demonstrates a decrease in the dielectric constant, and then the increase to the initial values [51]. The same trend was found for permittivity in polyimide [48,49], conductivity and charge dissipation rate in PDMS [54], paper-based insulators [155,161,162], and epoxy-based composites [60,61]. The authors associate this phenomena with low electron polarizability of fluorine atom and an increase of the free volume due to the relatively large volume of fluorine compared with hydrogen (which reduces the number of polarizable groups per unit volume) at the first stage, and then with a growth of the number of broken Si-C, Si-O, C-H, C-OH bonds, aromatic imide groups and polymer chain scission under long time fluorination.…”

Section: Electrical Properties Of Polymers After Direct Surface Fluorinationsupporting

confidence: 58%

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Direct Fluorination as Method of Improvement of Operational Properties of Polymeric Materials

et al. 2020

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Direct fluorination of polymers is a widely utilized technique for chemical modification. Such introduction of fluorine into the chemical structure of polymeric materials leads to laminates with highly fluorinated surface layer. The physicochemical properties of this layer are similar to those of perfluorinated polymers that differ by a unique combination of chemical resistance, weak adhesion, low cohesion, and permittivity, often barrier properties, etc. Surface modification by elemental fluorine allows one to avoid laborious synthesis of perfluoropolymers and impart such properties to industrial polymeric materials. The current review is devoted to a detailed consideration of wetting by water, energy characteristics of surfaces, adhesion, mechanical and electrical properties of the polymers, and composites after the direct fluorination.

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Section: Electrical Properties Of Polymers After Direct Surface Fluorinationsupporting

confidence: 58%

“…Fluorination prevents water absorption due to the appearance of hydrophobic fluorine-containing groups and a decrease in surface free energy. Thereby, direct fluorination partially suppresses the effect of lowering the breakdown voltage [48,162].…”

Section: Electrical Properties Of Polymers After Direct Surface Fluorinationmentioning

confidence: 99%

Direct Fluorination as Method of Improvement of Operational Properties of Polymeric Materials

et al. 2020

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“…The deposited charges contribute to the induced internal field E q and may also be a source where the electron generation process may start during the next discharge. However whether the induced internal field will be available depends on the decay time τ q which may have different origin such as ionic drift, conduction along the void surface and recombination, or trapping into dielectric or bulk conduction [17][18][19][20][21]. Depending on the trapping level some electrons may be detrapped in this process for a subsequent discharge.…”

Section: Discharge Process In Voidmentioning

confidence: 99%

“…It was shown by [3] that the leakage current in the void in polyethylene was negligibly small in untreated specimens when compared with ones subjected to discharges. Surface conductivity of polymeric voids that have not been exposed to PD is typically in the range 10 −14 to 10 −16 S [3,10,18]. When affected by PD degradation, this value may drop even by a few orders of magnitude [17].…”

Section: Discharge Process In Voidmentioning

confidence: 99%

Determination of Surface Erosion Degree inside Dielectric Void Subjected to Partial Discharges

Florkowski

2018

Acta Phys. Pol. A

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Novel approach to determine degree of surface erosion inside void subjected to partial discharges is presented. The deterioration of the void wall is associated with a time decay of accumulated charges, which reflects changing surface conductivity. The introduced methodology is based on non-continuous, chopped partial discharges sequencing. It can allow to estimate post discharge charge decay in the void, calculated as a time constant of the decay of internal accumulated electric field from deposited charges. The chopped sequence consists of multiple series of packets containing the base waveforms, followed by the defined delay time between subsequent packets. Train of base waveforms is applied to a dielectric material and as a whole epoch repeated within given measurement time. Main focus is on the internal mechanism inside voids, especially with respect to void surface conditions and charge decay phenomena. The experiments were carried out in a gaseous voids in polyethylene filled with air at atmospheric pressure. Presented method reveals impact of deposited charges creating an internal field, which interplays with superimposed external electric field in terms of the discharge inception conditions. It was demonstrated that this methodology can reveal quantitatively charge dynamics based on partial discharges phase-resolved pattern and applied analytics. Time constant of deposited charge decay in void was estimated based on two measurements with different fill factors.

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“…In order to regulate the interfacial charge migration properties and improve the electrical resistance along the surface, researchers at home and abroad have adopted a variety of different methods to modify the surface of polymer materials and come to fruition [4,11,12]. Du Boxue et al used direct fluorination to treat the polymer surface by replacing the H atoms with F atoms to form C-F bonds, shielding the internal deep traps and increasing the surface charge dissipation rate and flashing voltage along the surface [13,14]. Cheng Yonghong et al used the magnetron sputtering technique to sputter TiO 2 , Al 2 O 3 , and Cr 2 O 3 films on the surface of epoxy resin samples, resulting in faster surface charge dissipation [15].…”

Section: Introductionmentioning

confidence: 99%

Study on Improving Interface Performance of HVDC Composite Insulators by Plasma Etching

et al. 2020

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High-voltage direct-current composite insulators are faced with various challenges during operation, such as creeping discharge, umbrella skirt damage, abnormal heating and insulator breakage. Among them, the aging of the interface between the core rod and the sheath is one of the important causes of composite insulator failure. In order to improve the electrical resistance of the composite insulator interface, this study uses plasma etching to modify the surface of the glass-fiber-reinforced epoxy resin plastic to prepare the high-voltage direct-current composite insulator core rod–sheath samples. By analyzing the surface morphology of the epoxy resin, static contact angle and surface charge transfer characteristics, the control mechanism of the plasma etching treatment on the interface bonding performance and leakage current of composite insulator core rod–sheath samples were studied. The results show that proper etching time treatment can improve the trap energy level distribution and microstructure of epoxy resin and increase the discharge voltage along the surface; chemical bonding plasma etching can improve the interfacial bonding performance of core rod–sheath samples sheaths, reduce the leakage current of composite insulator core rod–sheath samples sheath specimens and improve their interfacial performance.

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Surface Potential Behavior of Direct-Fluorinated PPLP Under Quench Condition

Cited by 8 publications

References 25 publications

Direct Fluorination as Method of Improvement of Operational Properties of Polymeric Materials

Direct Fluorination as Method of Improvement of Operational Properties of Polymeric Materials

Determination of Surface Erosion Degree inside Dielectric Void Subjected to Partial Discharges

Study on Improving Interface Performance of HVDC Composite Insulators by Plasma Etching

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