Surface Plasma and Mold Deflash Treatment of Plated and Non-Plated Cu Leadframe for Leadframe-to-Mold Adhesion Improvement

Pulutan, Marty Lorgino; Fernandez, Matthew M.; Estolano, Janice

doi:10.1109/eptc53413.2021.9663878

Cited by 2 publications

(1 citation statement)

References 1 publication

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The main reasons for choosing a copper alloy are that it has the advantages of adhesion to the epoxy matrix, excellent electrical conductivity, and reasonable price, but it has the problem of being easily oxidized at room temperature. 9,10 Within the past five years, there has been a trend toward using nickel and nickel-plated substrates [11][12][13] or NiPu-plated substrates 14 rather than pure copper substrates. By plating with nickel, which has an attractive appearance and excellent corrosion resistance compared to existing copper, 15,16 it can be useful in products that require high reliability.…”

Section: Introductionmentioning

confidence: 99%

Synthesis of adhesion promoter for lead frame bonding and application of epoxy composite materials

Kim,

Kim

et al. 2024

Polymer Engineering & Sci

View full text Add to dashboard Cite

Polymer adhesion promoters were formulated to improve the adhesion strength of lead frame/epoxy composites. The poly(itaconic acid‐co‐acrylamide) (IAcAAM) was synthesized via free radical polymerization to improve the interfacial adhesion between Ni and Cu lead frames and epoxy composites. IAcAAM was synthesized by setting itaconic acid (IA) and acrylamide (AAM) at molar ratios of 7:3, 5:5, and 3:7. The interfacial adhesion mechanism was investigated by introducing IAcAAM with three different comonomer molar ratios. The adhesion strength between EMC and Cu and Ni substrates to which each IAcAAM was applied was measured using a universal testing machine, and the effect of IAcAAM with various IA:AAM molar ratios on the surface energy of EMC was closely studied. As a result, the adhesion properties of Ni lead frame/epoxy composite and Cu lead frame/epoxy composite were improved as small amounts of all IAcAAM samples were added to the epoxy mixture. We confirmed that IAcAAM with an appropriate molar ratio can be used in the EMC process and has the potential to increase the adhesion of epoxy composites and metal lead frames.Highlights A polymeric adhesive promoter was synthesized to enhance the adhesion strength of lead frame/epoxy composites. Poly(itaconic acid‐co‐acrylamide) (IAcAAM) was copolymerized from itaconic acid and acrylamide for this purpose. The adhesion strength of lead frame/epoxy composites was compared for different IAcAAM monomer contents and with a commercial adhesive promoter. IAcAAM showed superior adhesion strength in the Ni lead frame/epoxy composite material. The highest adhesion strength was achieved at a monomer composition of 5:5.

show abstract