Surface planarization of ZnO thin film for optoelectronic applications

Lee, Woo-Sun; Choi, Gwon-Woo; Seo, Yong-Jin

doi:10.1016/j.mejo.2008.07.048

Cited by 10 publications

(3 citation statements)

References 17 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…We adopted CMP to flatten the ZnO FSCW, and the schematic illustration of the CMP mechanism is shown in Figure e. CMP is a standard process, composed of a carrier head, a polishing pad, and a rotating and slurry feeding mechanism, applied in the planarization of silicon-based integrated circuits . During optimization of the CMP process for the ZnO FSCW, the conditions of low pressure and high rotating speed were chosen to enhance the polishing stability and reduce the quality deviation at a relatively low removal rate.…”

Section: Results and Discussionsupporting

confidence: 85%

“…CMP is a standard process, composed of a carrier head, a polishing pad, and a rotating and slurry feeding mechanism, applied in the planarization of silicon-based integrated circuits. 32 During optimization of the CMP process for the ZnO FSCW, the conditions of low pressure and high rotating speed were chosen to enhance the polishing stability and reduce the quality deviation at a relatively low removal rate. The as-grown ZnO FSCW has an average roughness of 24 nm through the coherence correlation interferometry (CCI) measurement.…”

Section: ■ Results and Discussionmentioning

confidence: 99%

See 1 more Smart Citation

Fabrication of Large-Scale High-Mobility Flexible Transparent Zinc Oxide Single Crystal Wafers

Chen

et al. 2021

ACS Appl. Mater. Interfaces

View full text Add to dashboard Cite

Single crystal wafers, such as silicon, are the fundamental carriers of advanced electronic devices. However, these wafers exhibit rigidity without mechanical flexibility, limiting their applications in flexible electronics. Here, we propose a new approach to fabricate 1.5 in. flexible functional zinc oxide (ZnO) single crystal wafers with high electron mobility (>100 cm2 V–1 s–1) and optical transparency (>80%) by a combination of thin-film deposition, a chemical solution method, and surficial treatment. The uniformity of the flexible single crystal wafers is examined by an advanced scanning X-ray diffraction technique and photoluminescence spectroscopy. The transport properties of ZnO flexible single crystal wafers retain their pristine states under various bending conditions, including cyclability and endurability. This approach demonstrates a breakthrough in the fabrication of the flexible single crystal wafers for future flexible optoelectronic applications.

show abstract

Section: Results and Discussionsupporting

confidence: 85%

Section: ■ Results and Discussionmentioning

confidence: 99%

Fabrication of Large-Scale High-Mobility Flexible Transparent Zinc Oxide Single Crystal Wafers

Chen

et al. 2021

ACS Appl. Mater. Interfaces

View full text Add to dashboard Cite

show abstract

“…This technique yielded optimal conditions of high removal rate, low resistivity, and high transmittance using the chemical mechanical polishing process [20]. Additionally, Lee and Gupta's research indicated that CMP resulted in increased surface uniformity and improved transmittance of ITO thin films [21,22]. Li et al confirmed that chemical polishing of a film can reduce film surface roughness, surface defects, and leakage current and improve photoelectric properties [23].…”

Section: Introductionmentioning

confidence: 98%

Analysis of Surface Roughness during Surface Polishing of ITO Thin Film Using Acoustic Emission Sensor Monitoring

Kim,

Lee,

Lee

2023

Coatings

View full text Add to dashboard Cite

This study investigates the intricate process of surface polishing for ITO-coated Pyrex glass utilizing magnetic abrasive polishing (MAP) while employing acoustic emission (AE) sensors for real-time defect monitoring. MAP, known for its versatility in achieving nanoscale thickness processing and uniform surfaces, has been widely used in various materials. However, the complexity of the process, influenced by multiple variables like cutting conditions, material properties, and environmental factors, poses challenges to maintaining high surface quality. To address this, a sensor monitoring system, specifically one that uses AE sensors, was integrated into the MAP process to detect and confirm defects, providing real-time insights into machining conditions and outcomes. AE sensors excel in identifying material deterioration, microcrack formation, and wear, even in cases of minor damage. Leveraging AE sensor data, this study aims to minimize surface defects in ITO thin films during MAP while optimizing surface roughness. The investigation involves theoretical validation, magnetic density simulations, and force sensor pressure measurements to identify factors influencing surface roughness. ANOVA analysis is employed to determine optimal processing conditions. Additionally, this study compares the identified optimal roughness conditions with those predicted by AE sensor parameters, aiming to establish a correlation between predicted and achieved surface quality. The integration of AE sensor monitoring within the MAP process offers a promising avenue for enhancing surface quality by effectively identifying and addressing defects in real time. This comprehensive analysis contributes to advancing the understanding of surface polishing methodologies for ITO-coated Pyrex glass, paving the way for improved precision and quality in thin-film surface processes.

show abstract