Abstract:This paper demonstrated the effect of functionalized magnesium oxide (MgO) nanoparticles with 3-(Aminopropyl) triethoxysilane (APTES) as llers on the mechanical and thermal properties of epoxy composite. The functionalization of MgO (S-MgO) considerably improved the inteface between the MgO and epoxy resin. The mechanical properties of the composites revealed that the addition of functionalized MgO improved their tensile strength, modulus of elasticity, and ductility when compared to neat epoxy. In compare to … Show more
“…To maintain high electrical insulating properties, ceramic fillers must be used. Among the ceramic fillers, the most widely explored ones include: carbides, such as carbide-based MXenes [16] and silicon carbide (SiC) [23,24]; oxides, such as silicon oxide (SiO 2 ) [25,26], aluminum oxide (Al 2 O 3 ) [27], and magnesium oxide (MgO) [28,29]; and nitrides, such as aluminum nitride (AlN) [30,31] and boron nitride (BN) [32][33][34]. Among these, hexagonal boron nitride (BN) is considered highly promising [35][36][37].…”
This study explores the potential of novel boron nitride (BN) microplatelet composites with combined thermal conduction and electrical insulation properties. These composites are manufactured through Fusion Deposition Modeling (FDM), and their application for thermal management in electronic devices is demonstrated. The primary focus of this work is, therefore, the investigation of the thermoplastic composite properties to show the 3D printing of lightweight polymeric heat sinks with remarkable thermal performance. By comparing various microfillers, including BN and MgO particles, their effects on material properties and alignment within the polymer matrix during filament fabrication and FDM processing are analyzed. The characterization includes the evaluation of morphology, thermal conductivity, and mechanical and electrical properties. Particularly, a composite with 32 wt% of BN microplatelets shows an in-plane thermal conductivity of 1.97 W m−1 K−1, offering electrical insulation and excellent printability. To assess practical applications, lightweight pin fin heat sinks using these composites are designed and 3D printed. Their thermal performance is evaluated via thermography under different heating conditions. The findings are very promising for an efficient and cost-effective fabrication of thermal devices, which can be obtained through extrusion-based Additive Manufacturing (AM), such as FDM, and exploited as enhanced thermal management solutions in electronic devices.
“…To maintain high electrical insulating properties, ceramic fillers must be used. Among the ceramic fillers, the most widely explored ones include: carbides, such as carbide-based MXenes [16] and silicon carbide (SiC) [23,24]; oxides, such as silicon oxide (SiO 2 ) [25,26], aluminum oxide (Al 2 O 3 ) [27], and magnesium oxide (MgO) [28,29]; and nitrides, such as aluminum nitride (AlN) [30,31] and boron nitride (BN) [32][33][34]. Among these, hexagonal boron nitride (BN) is considered highly promising [35][36][37].…”
This study explores the potential of novel boron nitride (BN) microplatelet composites with combined thermal conduction and electrical insulation properties. These composites are manufactured through Fusion Deposition Modeling (FDM), and their application for thermal management in electronic devices is demonstrated. The primary focus of this work is, therefore, the investigation of the thermoplastic composite properties to show the 3D printing of lightweight polymeric heat sinks with remarkable thermal performance. By comparing various microfillers, including BN and MgO particles, their effects on material properties and alignment within the polymer matrix during filament fabrication and FDM processing are analyzed. The characterization includes the evaluation of morphology, thermal conductivity, and mechanical and electrical properties. Particularly, a composite with 32 wt% of BN microplatelets shows an in-plane thermal conductivity of 1.97 W m−1 K−1, offering electrical insulation and excellent printability. To assess practical applications, lightweight pin fin heat sinks using these composites are designed and 3D printed. Their thermal performance is evaluated via thermography under different heating conditions. The findings are very promising for an efficient and cost-effective fabrication of thermal devices, which can be obtained through extrusion-based Additive Manufacturing (AM), such as FDM, and exploited as enhanced thermal management solutions in electronic devices.
“…7) Until now, researchers have mixed with high thermal conductivity such as aluminum nitride (AlN), alumina (Al 2 O 3 ), silicon carbide (SiC), magnesium oxide (MgO), and graphene to increase the thermal conductivity of the polymer matrix. [8][9][10][11][12] Carbon-based materials such as graphene, carbon nanotubes, and fullerenes have been used as fillers for optical devices and heat-dissipation materials. 13) Unlike other fields, electrical insulation materials and heat dissipation require high voltage withstand capability along with electrical insulation.…”
This comprehensive study delves into the intricate process of exfoliating and functionalizing boron nitride nanosheets (BNNSs) extracted from hexagonal boron nitride (h-BN), and meticulously explores their potential application within epoxy composites. The extensive research methodology encompasses a sequence of treatments involving hydrothermal and sonication processes aimed at augmenting the dispersion of BNNSs in solvents. Leveraging advanced analytical techniques such as Raman spectroscopy, X-ray diffraction, and FTIR spectroscopy, the study rigorously analyzes a spectrum of changes in the BNNS's properties, including layer count variations, interlayer interactions, crystal structure modifications, and the introduction of functional groups. The research also rigorously evaluates the impact of integrating BNNSs, specifically glycidyl methacrylate (GMA)-functionalized BNNSs, on the thermal conductivity of epoxy composites. The conclusive findings exhibit notable enhancements in thermal properties, predominantly attributed to the enhanced dispersion of fillers and enhanced interactions within the epoxy matrix. This pioneering work illuminates the wide potential of functionalized BNNSs for significantly enhancing the thermal conductivity of epoxy composites, paving the way for advanced materials engineering and practical applications.
“…One possible route to escalate the interference in the filler and matrix is by the addition of functional moieties that generate an effective thermal conductive path between the filler particles and the polymer matrix [2,25,26]. Surface modification helps to generate good interfacial bonds and create an effective thermal bridge for the transportation of phonons [27]. Recently, many reports published that the importance of surface modification is evident in the enhancement of thermal conductivity [2,[28][29][30][31].…”
The effect of multiwall carbon nanotubes (MWCNTs) and magnesium oxide (MgO) on the thermal conductivity of MWCNTs and MgO-reinforced silicone rubber was studied. The increment of thermal conductivity was found to be linear with respect to increased loading of MgO. In order to improve the thermal transportation of phonons 0.3 wt % and 0.5 wt % of MWCNTs were added as filler to MgO-reinforced silicone rubber. The MWCNTs were functionalized by hydrogen peroxide (H2O2) to activate organic groups onto the surface of MWCNTs. These functional groups improved the compatibility and adhesion and act as bridging agents between MWCNTs and silicone elastomer, resulting in the formation of active conductive pathways between MgO and MWCNTs in the silicone elastomer. The surface functionalization was confirmed with XRD and FTIR spectroscopy. Raman spectroscopy confirms the pristine structure of MWCNTs after oxidation with H2O2. The thermal conductivity is improved to 1 W/m·K with the addition of 20 vol% with 0.5 wt % of MWCNTs, which is an ~8-fold increment in comparison to neat elastomer. Improved thermal conductive properties of MgO-MWCNTs elastomer composite will be a potential replacement for conventional thermal interface materials.
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