Surface modification of epoxy resin using He/CF 4 atmospheric pressure plasma jet for flashover withstanding characteristics improvement in vacuum

Time Evolution Characterization of Atmospheric-Pressure Plasma Jet (APPJ)-Synthesized Pt-SnOx Catalysts

“…APPs have been used for processing various types of materials, such as carbon nanotubes [3,7,8] and reduced graphene oxides [9][10][11]. Applications of APPs for surface cleaning or modification [12][13][14], deposition of metal oxides [15,16], and syntheses of metal compounds from liquid precursors [6,17,18] have been extensively investigated.…”

Enduring and Stable Surface Dielectric Barrier Discharge (SDBD) Plasma Using Fluorinated Multi-Layered Polyimide

“…In another aspect of surface morphology, due to an etching effect of plasma discharge, surface roughness increased for the fluorinated PI as shown in Figure 12b,c while the top layer was almost removed for the un-fluorinated multi-layered PI; this indicates that the fluorination layer had positive effects on plasma etching inhibition. In addition, during the plasma process, rougher surface caused a variation of electron movement trajectory and the increase of diffuse reflection [41]. The travel distance of secondary electrons then decreased, that is to say they cannot gain sufficient energy from the electrical field, subsequently, collision energy between the electrons and the dielectric surface was also weakening.…”

UV-cured nanocomposite coating for surface charging mitigation and breakdown strength enhancement: exploring the combination of surface topographical structure and perfluorooctyl chain

“…To fully exhibit the great advantages of this research in the industrial applications, a comparison is carried out between the ashover mitigation strategies reported in recent literatures and experimental works in this paper. Flashover voltage (U ho ) improvement ratio in vacuum, and other factors of direct uorination, 39 Mechanical polishing, 40 plasma etching, 14 laser grooving 41 are compared and the corresponding results are summarized in Fig. 7.…”

“…1 (upperright). Intricate micro or macro topography created by plasma etching, 14 mechanical grooving 15 or polishing, 16 and laser shaping, 17 are used to set barriers for discharge development and improve conductivity to alleviate charge accumulation. Chemical functionalization methods including direct or plasma assisted uorination, 18,19 radical elimination, 10 and nano llers addition, 20 can suppress charge generation and accelerate dissipation as well.…”