Surface modification of aluminium nitride powder

Li, Y. Q.; Qiu, Tai; Xu, Jun; He, Xiangdong

doi:10.1007/bf00275333

Cited by 11 publications

(2 citation statements)

References 8 publications

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“…The surface roughness of these AlN fragments was the same before and after the baking treatment, so that the increase in the contact angle could be attributed to the desorption of the hydroxyl groups. [42][43][44] Notably, the amount of Pd catalyst used in the silane-Pd process is five times less than that used in the Pd/Sn colloid process, as determined using ICP and shown in Fig. 7c.…”

Section: Resultsmentioning

confidence: 99%

Adhesion Enhancement of a Plated Copper Layer on an AlN Substrate Using a Chemical Grafting Process at Room Temperature

Shen

Dow

2014

J. Electrochem. Soc.

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AlN substrates have been extensively used for heat dissipation, especially in high-power light-emitting diodes (LEDs). However, the AlN substrate is an electric insulator and thus needs to be metalized to serve as an electric circuit carrier and heat conductor for LED packaging. Herein, we propose a wet process that can be performed at room temperature to metallize AlN substrates. The wet metallization process involves copper electroless deposition and copper electroplating. The catalyst used for the copper electroless deposition was PdCl 2 , which was chemically grafted onto the AlN surface. The chemical grafting agent was 3-(2-aminoethylamino)propyltrimethoxysilane (APTMS). Before the chemical grafting step, an etching step in KOH solution was critical for good adhesion of the plated copper layer. The electroless copper depositions were catalyzed using chemically grafted Pd and a commercial Sn/Pd colloid. An adhesion comparison test of the plated copper layers was performed to demonstrate that the copper adhesion performance obtained with the chemically grafted Pd process was substantially better than that obtained with the commercial Sn/Pd colloid process.

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Section: Resultsmentioning

confidence: 99%

Adhesion Enhancement of a Plated Copper Layer on an AlN Substrate Using a Chemical Grafting Process at Room Temperature

Shen

Dow

2014

J. Electrochem. Soc.

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“…It has been reported that these particles can be effectively protected from moisture by surface treatment with carboxylic acids, in particular, stearic acid. 20), 21) However, the organic layers formed on the AlN surfaces by reacting with carboxylic acids may increase the thermal resistance because of their low thermal conductivities. As an alternative method to improve water-resistance, ¡-Al 2 O 3 layers, which have higher thermal conductivity than that of the organic layers, can be formed on the AlN particle surfaces by oxidizing them at high temperatures.…”

Section: Introductionmentioning

confidence: 99%

Fabrication of highly water-resistant AlN particles with hybrid α-Al<sub>2</sub>O<sub>3</sub>/organic layers

Tanaka

Hojo

Kagawa

et al. 2014

J. Ceram. Soc. Japan

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The water resistance of AlN particles was improved by surface coating with hybrid ¡-Al 2 O 3 /organic layers. To maintain thermal conductivity, the higher-thermal-conductivity ¡-Al 2 O 3 layer was designed to cover most of the AlN surface, and the lowerthermal-conductivity organic layer was formed on the remaining area. Scanning electron microscopy, energy dispersive X-ray spectrometry and thermogravimetric analyses of the particles revealed that the small amount of organic layer was filling the cracks in the ¡-Al 2 O 3 layer. The water resistant property was evaluated by a water immersion test. The pH of water dispersing the particles with hybrid layers was less than that of water dispersing the particles coated only with ¡-Al 2 O 3 or organic layers, which indicated that the particles with hybrid layers had improved water resistance. The particles have applications in polymer composites for insulation in electronic devices which require improved reliability.

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Facile synthesis of BaSO4@SiO2@TiO2 composites and its coating mechanism analysis

Jin

Liu

2023

J Coat Technol Res

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Surface modification of aluminium nitride powder

Cited by 11 publications

References 8 publications

Adhesion Enhancement of a Plated Copper Layer on an AlN Substrate Using a Chemical Grafting Process at Room Temperature

Adhesion Enhancement of a Plated Copper Layer on an AlN Substrate Using a Chemical Grafting Process at Room Temperature

Fabrication of highly water-resistant AlN particles with hybrid α-Al<sub>2</sub>O<sub>3</sub>/organic layers

Facile synthesis of BaSO4@SiO2@TiO2 composites and its coating mechanism analysis

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