2010
DOI: 10.1016/j.snb.2009.10.001
|View full text |Cite
|
Sign up to set email alerts
|

Surface modification-assisted bonding of polymer-based microfluidic devices

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1
1
1

Citation Types

1
66
0

Year Published

2011
2011
2019
2019

Publication Types

Select...
8

Relationship

0
8

Authors

Journals

citations
Cited by 86 publications
(68 citation statements)
references
References 28 publications
1
66
0
Order By: Relevance
“…Since normal adhesives cannot be used for the bonding of PDMS a combination of bonding and clamping is used to build first prototypes. The adhesive problem can be addressed by modified bonding techniques (KS Lee and Ram 2009;Tang and Lee 2010;Vlachopoulou et al 2009;Sunkara et al 2011;Tennico et al 2010) or PDMS interface bonding (Suk et al 2008;Chow et al 2006). The actuator is insensitive to bonding quality because not all the paraffin needs to be molten for closure of the valve and the remaining solid paraffin will seal the cavity.…”
Section: Microvalve Assemblymentioning
confidence: 99%
“…Since normal adhesives cannot be used for the bonding of PDMS a combination of bonding and clamping is used to build first prototypes. The adhesive problem can be addressed by modified bonding techniques (KS Lee and Ram 2009;Tang and Lee 2010;Vlachopoulou et al 2009;Sunkara et al 2011;Tennico et al 2010) or PDMS interface bonding (Suk et al 2008;Chow et al 2006). The actuator is insensitive to bonding quality because not all the paraffin needs to be molten for closure of the valve and the remaining solid paraffin will seal the cavity.…”
Section: Microvalve Assemblymentioning
confidence: 99%
“…This was followed by surface modification of both PMMA substrates using oxygen plasma and tetraethyl orthosilicate (TEOS ≥ 99.0%). 49 The two substrates were brought into contact and pressed together with a hot press for 20 min at 75 °C and 300 psi to form the final microchip. Finally, the bonded chip was baked at 60 °C for 2 h to increase the bond strength.…”
Section: Methodsmentioning
confidence: 99%
“…16 In the bonding process, first a second piece of PMMA was trimmed to size, cleaned and dried ( Fig. 2(l)).…”
Section: Microchip Fabricationmentioning
confidence: 99%