2017
DOI: 10.1039/c7ra08516h
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Surface modification and magnetic alignment of hexagonal boron nitride nanosheets for highly thermally conductive composites

Abstract: With the current development of microelectronic technology, thermally conductive and electrically insulating encapsulation materials are in urgent demand. Hexagonal boron nitride nanosheets (BNNSs) possess a highly anisotropic thermal property. Therefore, the thermal conductivity of the BNNSs-based composites can be dramatically increased through the orientation of fillers. However, it is still difficult to well align BNNSs at high loadings due to the intensive aggregation. Herein, highly ordered thermoplastic… Show more

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Cited by 49 publications
(38 citation statements)
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“…We developed a new class of magnetic soft materials that exhibited drastic and reversible changes in the dynamic modulus by weak magnetic fields [5,6,7]. In addition to the viscoelastic property, the magnetic field response of physical properties such as surface property [8,9], electric conductivity [10,11], thermal conductivity [12,13,14], have also been reported. These changes in physical properties by magnetic fields are confirmed results of the change of the inner structure of magnetic elastomers.…”
Section: Introductionmentioning
confidence: 99%
“…We developed a new class of magnetic soft materials that exhibited drastic and reversible changes in the dynamic modulus by weak magnetic fields [5,6,7]. In addition to the viscoelastic property, the magnetic field response of physical properties such as surface property [8,9], electric conductivity [10,11], thermal conductivity [12,13,14], have also been reported. These changes in physical properties by magnetic fields are confirmed results of the change of the inner structure of magnetic elastomers.…”
Section: Introductionmentioning
confidence: 99%
“…So far, we have developed a new class of magnetic soft materials that exhibit drastic and reversible changes in the dynamic modulus by weak magnetic fields [5,6,7]. In addition to the viscoelastic property, the magnetic-field response of physical properties such as surface property [8,9], electric conductivity [10,11], thermal conductivity [12,13,14], have also been reported.…”
Section: Introductionmentioning
confidence: 99%
“…Thermal dissipation is very important for increasing the performance, lifetime, and reliability of advanced electronic devices with increased power density, together with their miniaturization, integration, and the functionalization of traditional electronics. 1,2 Metals, carbon materials, ceramic materials, and polymer materials have been developed to meet the thermal requirements with the aim of improving heat dissipation. However, short circuits and electron magnetic shielding restrict the application of carbon-based, metal-based, and filled materials because of their electrical conductivity.…”
Section: Introductionmentioning
confidence: 99%