Surface kinetics of electrodeposited silver on gold probed with potential step and optical second harmonic generation techniques

Voltammetric and amperometric analyses of electrochemical nucleation: electrodeposition of copper on nickel and tantalum

“…The instruments and experimental procedures used in this work are discussed elsewhere in detail [34][35][36][37]. In brief, the Ni and Ta working electrodes, both 6.5 mm diameter polycrystalline cylinders (mounted in Teflon holders) were polished down in several steps, with 1, 0.3, 0.1 and 0.05 lm alumina abrasives.…”

“…(15) assumes that the diffusion and growth processes are not affected by any complex effects of surface blocking by products of side reactions. This last effect, in particular, is often associated with certain metal electrodes (including Ni and Ta) that are likely to contain native oxides [34]. These oxides are likely to be spatially inhomogeneous across the electrode surface and thus, may change the nucleation efficiency of an oxide-free uniform surface.…”

An SFG and DFG investigation of polycrystalline Au, Au–Cu and Au–Ag–Cu electrodes in contact with aqueous solutions containing KCN

“…A spectroelectrochemical approach has been recently taken: bulk field VIS-ERS, VIS-SHG and multiline SERS offer the possibility of significant breakthroughs in the study of electronic effects relevant to in situ Au-alloy work. In situ electrochemical SHG has been employed in the case of bimetallic interfaces, in the following UPD and electrodeposition studies: (i) polycrystalline Au electrodes and deposition of Ag [11], Pd [12] and Te [13]; (ii) Au(1 1 1) electrodes and deposition of Cu [14,15], Ag, Pb, Tl [15] and Te [16]; (iii) deposition of Cu on polycrystalline Ag [14]; (iv) deposition of Cd on polycrystalline Cu [17]; (v) polycrystalline Mo substrates and deposition of Cd [18] and In [19]. Regarding alloys, in situ SHG has been employed in the study of the corrosion of brass [20,21].…”

Electrochemical investigation of the roles of oxyanions in chemical–mechanical planarization of tantalum and tantalum nitride

“…11 are typical of strong/fast chemisorptions [27,41]. In comparison with s ad (Ta), the values of s ad1 (TaN) and s ad2 (TaN) in Fig.…”

“…The symbols and the lines represent experimental data and CNLS calculated fits to the data, respectively. Figure 8a, which represents a standard model of anion adsorption on oxidized metals [27,41], shows the CNLS-analyzed EEC obtained for Ta. R u is the uncompensated solution resistance, which essentially remains around 0.5 X cm 2 .…”