1987
DOI: 10.1016/0001-6160(87)90113-1
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Surface intergranular cracking in large strain fatigue

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Cited by 49 publications
(13 citation statements)
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“…Therefore, it is possible that the grain boundary is damaged (microvoid, microcrack) by slips produced by hydrogen. For example, an intergranular crack initiates by cyclic slip at elevated temperature (10) or at low cycle fatigue (11), (12) .…”
Section: Introductionmentioning
confidence: 99%
“…Therefore, it is possible that the grain boundary is damaged (microvoid, microcrack) by slips produced by hydrogen. For example, an intergranular crack initiates by cyclic slip at elevated temperature (10) or at low cycle fatigue (11), (12) .…”
Section: Introductionmentioning
confidence: 99%
“…Kronberg and Wilson noted the significance of low˙values for nucleation and growth during secondary recrystallization of copper as they found less segregation existing in these low˙boundaries. More recently, experimental studies have shown that CSL boundaries of high CSL density/low˙value do not crack during fatigue of Ni [17], stress corrosion of a Ni-based superalloy [18], and cavitation of Cu [19]. By looking at each lattice relative to the supercell background, we can see that the (bottom left) lattice is in perfect agreement but after undergoing the rotation (top right), the blue atoms correspond to the background meanwhile the red and silver atoms are interchanged.…”
Section: Introductionmentioning
confidence: 99%
“…Based on the fatigue cracking along PSBs, the volume fraction of PSBs has been considered as a fatigue damage parameter when predicting the fatigue life of polycrystals [9–11 ]. On the other hand, in polycrystalline materials, it is found that GBs [14–19 ] and twin boundaries (TBs) [20–22 ] can also become the preferential sites leading to fatigue cracking. The crystallographic conditions and dislocation mechanisms of intergranular fatigue cracking have been analysed by Kim and Laird [14,15 ], Chang [16], and Christ [17 ].…”
Section: Introductionmentioning
confidence: 99%