“…There are many techniques to produce above said sizes and shapes of microchannels including both the conventional as well as non-conventional techniques. But there are also number of problems linked with EDM and wire-EDM such as low productivity, high tool wear rate, lack of precision due to tool wear, unsuitable for batch production or multi-channels [226], thick recast layer (from 2.5 to 30 µm) [227], heat affected layer of 40-100 um [227], thick white layers (6-8 µm) with micro-cracks [228], poor surface integrity [229] and necessary post processing requirements [230]. For example, the conventional micro-milling process using micro-tools are commonly used but the high tooling cost, burr formation, material constraints offered by difficult-to-machine materials, chip adhesion, high thrust forces, heat affected zone and striation marks are the obvious drawbacks of conventional micro-milling and consequently restrict the process for precise micro-featuring especially in hard-to-machine materials such as titanium and nickel alloys [215][216][217][218][219].…”