Surface characterization and corrosion behavior of a novel gold-imitation copper alloy with high tarnish resistance in salt spray environment

Xiao, Zhu; Li, Zhou; Zhu, Anyin; Zhao, Yuyuan; Chen, Jing‐Lin; Zhu, Yuntian

doi:10.1016/j.corsci.2013.05.026

Cited by 53 publications

(13 citation statements)

References 22 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…These results are generally consistent with Cu2p spectra. However, the difference is that the Cu(OH) 2 did not appear in the Cu2p spectra, and this phenomenon is in accordance with the literature by Xiao [33]. They considered that the intensity of the Cu(OH) 2 in Cu2p spectra is pretty weak [33], while the combination of Cu(OH) 2 and Ni(OH) 2 lead to the result in O1s spectra.…”

Section: Resultssupporting

confidence: 84%

“…It is demonstrated that the primary components of the product film are CuO and Cu 2 O with the prolonging exposure time from 7 days to 56 days. It is difficult to distinguish the peaks of metallic Cu and Cu 2 O due to the similar binding energy, so they are expressed as Cu/Cu 2 O [33]. After exposure to seawater for seven days, as displayed in Figure 1a, two peaks at the B.E.…”

Section: Resultsmentioning

confidence: 99%

“…To further detect the composition at different depths of the corrosion surface, the XPS of the prepared specimens was carried out by K-Alpha X-ray photoelectron spectrometer (thermo escalab 250, Thermo Fisher Scientific, Gloucester, UK). Prior to XPS test, the specimens were treated in deionized water and dried using a vacuum oven [33]. The Al Ka X-ray source were used to motivate the high-resolution photoelectron of Cu2p and O1s, while the output data were analyzed by the XPS PEAK 1 software (Version 4.1).…”

Section: Methodsmentioning

confidence: 99%

See 2 more Smart Citations

Surface Characterization and Corrosion Behavior of 90/10 Copper-Nickel Alloy in Marine Environment

Jin

Zhang

et al. 2019

Materials

View full text Add to dashboard Cite

Surface characterization and corrosion behavior of 90/10 copper-nickel alloy in seawater from Xiamen bay at 30 °C for 56 days were investigated in this study. The results indicated that the corrosion product layer was mainly a mixture of CuO, Cu2O, and Cu(OH)2, with a transition to CuCl, CuCl2, and Cu2(OH)3Cl during the corrosion process. However, as corrosion proceeds, the resistance of the product film was reduced due to its heterogeneous and fairly porous structures, which led to local corrosion of the alloy. The corrosion potentials (Ecorr) increase while corrosion current densities (Icorr) decrease with time because of the formation of protective oxide film.

show abstract

Section: Resultssupporting

confidence: 84%

Section: Resultsmentioning

confidence: 99%

Section: Methodsmentioning

confidence: 99%

See 1 more Smart Citation

Surface Characterization and Corrosion Behavior of 90/10 Copper-Nickel Alloy in Marine Environment

Jin

Zhang

et al. 2019

Materials

View full text Add to dashboard Cite

show abstract

“…SEM/EDS analysis.-The morphologies and the thickness of the corrosion layer were observed using a JSM-5610 LV scanning electron microscope (Electron Co., Japan) [6].…”

Section: Materials Characterizationmentioning

confidence: 99%

Corrosion Morphologies and Products of Copper Immersed in Dimethyl Sulfite Hydrolysis Solution

Tang¹,

Yan²,

Yang³

et al. 2017

dtmse

View full text Add to dashboard Cite

The corrosion products and morphologies of copper when immersed in the dimethyl sulfite hydrolysis solution for half a month in a sealed container were investigated by optical microscopy (OM), X-ray diffraction (XRD), scanning electron microscopy (SEM). The Cu 2 O phase could be identified in the corrosion products. Two typical corrosion morphologies could be found in the SEM image, namely corrosion pits and cracks. This observation provided better understanding of the corrosion behaviors of copper in dimethyl sulfite hydrolysis solution.

show abstract

“…Typical corrosion quantification techniques that follow the salt spray tests are macroscopic and microscopic examinations [123,124,129,130], contact resistance [131], pits counting, and mass loss measurements [132,133]. As part of a larger study, a novel method to quantify cosmetic corrosion has been report by Zhu et al [134]; it involves colour measurements determined by a spectrophotometer (also known as a colorimeter).…”

Section: Salt Spraymentioning

confidence: 99%

Nickel-based electrodeposits for corrosion protection of smart card contacts

Murugan¹

View full text Add to dashboard Cite

Reliability of smart cards depends extensively on the corrosion resistance of the electrical contacts they contain as these contacts are primarily exposed to the environment. Although corrosion as an entirety is a century old problem, the corrosion of thin electrical contacts has been rarely studied in a systematic manner. Cu is typically used as substrate material for electrical contacts and nickel based barrier layer coating have been essential to suppress copper diffusion through the gold topcoat. This thesis aims to bridge knowledge gaps in literature with regards to the corrosion behaviour of Ni and Ni-P barrier coated electrical contacts.Much work has been dedicated to the corrosion resistance of electroless Ni-P deposits but research on electrolytic deposits is limited. The impact of electrodepositing parameters on corrosion resistance has not been well documented. This thesis aids the understanding of the electrodepositing parameters and their implications on corrosion resistance. Moreover, corrosion behaviour due to different arrangement of thin Ni and Ni-P stacks (< 3 μm) is unknown. This thesis also explores different thin Ni and Ni-P stacks and its corrosion resistance to salt spray (SS) and mixed flowing gas (MFG) environments. The corrosion behaviour of these stacks, corrosion mechanism and causes of corrosion disparity have been also discussed in this report. The thesis is bounded by three main considerations viz., method and type of deposition, and corrosion testing methods. Electrodeposition was the choice of deposition technique, Ni and Ni-P electrodeposits were chosen barrier layers and lastly, accelerated tests which simulate atmospheric corrosion were employed.The research starts with a systematic study on the electrodepositing parameters and their influence on the corrosion resistance of electrical contacts. Corrosion products due to the neutral salt spray (NSS) and mixed flowing gas (MFG) tests were characterised through spectroscopic and diffractions studies. Electrical contacts exposed to NSS tests produced green corrosion residues which consist of CuCl (nantokite) and CuCl2(OH)3 Abstract ii (clinoatacamite) and brown residues which consist of Cu2O (cuprite). Electrical contacts exposed to MFG test produces copper sulfides (major) and nickel sulfides (minor). Also increasing the thickness of Ni consistently improved the corrosion resistance in both neutral NSS and MFG corrosion tests. However, the influence of Ni thickness on corrosion was overshadowed by the Ni-P thickness. Increasing the thickness of Ni-P deposits resulted in higher corrosion in the NSS environment and decreased corrosion under the MFG environment. Although initial results pointed towards a disparity that Ni-P may not be suitable for corrosion protection in environments with heavy chlorine concentration but appropriate for sulfur-containing corrosion media, subsequent in-depth studies revealed that this disparity was due to the high edge porosity caused by fast plating. Subsequently, the arrangement of Ni and Ni-P on Cu...

show abstract

Surface characterization and corrosion behavior of a novel gold-imitation copper alloy with high tarnish resistance in salt spray environment

Cited by 53 publications

References 22 publications

Surface Characterization and Corrosion Behavior of 90/10 Copper-Nickel Alloy in Marine Environment

Surface Characterization and Corrosion Behavior of 90/10 Copper-Nickel Alloy in Marine Environment

Corrosion Morphologies and Products of Copper Immersed in Dimethyl Sulfite Hydrolysis Solution

Nickel-based electrodeposits for corrosion protection of smart card contacts

Contact Info

Product

Resources

About