Surface adhesion engineering for robust organic semiconductor devices

Abstract

Devices based on organic semiconductors have been widely used in various applications, for example, organic photovoltaics, organic thermoelectrics, organic solar cells, organic field-effect transistors, and organic sensors. The robust construction...

Preparation and Photocatalysis Characteristics of Flower-like ZnO by Microwave Method

“…ZnO like ZnO is widely used in batteries, sensors, antibacterial, photocatalysis and other aspects, which has caused extensive research. The preparation methods of flower like ZnO mainly include solution method, hydrothermal method and microwave method [5][6][7][8]. Microwave synthesis method is a new synthesis method in recent years.…”

Adhesive Properties of Semiconducting Polymers: Poly(3-alkylthiophene) as an Ersatz Glue

“…The way in which mechanical energy is absorbed and dissipated within a semiconducting polymer film is governed by its molecular structure and the way that structure assembles itself in the solid state . For a device stack comprising multiple polymeric films that are deposited sequentially, the interactions between the layersincluding physical interpenetration and electrostatic effectsalso influence the adhesive strength at the interface. , As in a purpose-designed adhesive (e.g., sticky tape), mechanical work can also be dissipated by the viscoelastic behavior of the semiconducting polymer. Adhesive properties are thus determined by both the properties of the bulk and of the interfaces. ,, For semiconducting polymers, adhesive properties having their origins in electrostatics (e.g., van der Waals forces) are influenced by the presence of polar and polarizable groups, the ratio of saturated to unsaturated bonds, the packing density of the film, and possibly the molecular orientation (texture) at the surface .…”

“…For a device stack comprising multiple polymeric films that are deposited sequentially, the interactions between the layersincluding physical interpenetration and electrostatic effectsalso influence the adhesive strength at the interface. , As in a purpose-designed adhesive (e.g., sticky tape), mechanical work can also be dissipated by the viscoelastic behavior of the semiconducting polymer. Adhesive properties are thus determined by both the properties of the bulk and of the interfaces. ,, For semiconducting polymers, adhesive properties having their origins in electrostatics (e.g., van der Waals forces) are influenced by the presence of polar and polarizable groups, the ratio of saturated to unsaturated bonds, the packing density of the film, and possibly the molecular orientation (texture) at the surface . Adhesive properties arising from molecular dynamicsincluding interpenetration and viscoelasticityare influenced by molecular weight and dispersity, as well as the inclusion of tackifiers, plasticizers, and dopants. − The mechanical properties are also influenced extrinsically by processing methods, operating temperature, and thermal history. ,, …”

“…32 For a device stack comprising multiple polymeric films that are deposited sequentially, the interactions between the layers�including physical interpenetration and electrostatic effects�also influence the adhesive strength at the interface. 32,33 As in a purpose-designed adhesive (e.g., sticky tape), mechanical work can also be dissipated by the viscoelastic behavior of the semiconducting polymer. Adhesive properties 34 are thus determined by both the properties of the bulk and of the interfaces.…”

“…32,35,36 For semiconducting polymers, adhesive properties having their origins in electrostatics 37 (e.g., van der Waals forces) are influenced by the presence of polar and polarizable groups, the ratio of saturated to unsaturated bonds, the packing density of the film, and possibly the molecular orientation (texture) at the surface. 33 Adhesive properties arising from molecular dynamics�including interpenetration and viscoelasticity�are influenced by molecular weight and dispersity, as well as the inclusion of tackifiers, plasticizers, and dopants. 38−40 The mechanical properties are also influenced extrinsically by processing methods, operating temperature, and thermal history.…”