Sur l'oxydation si?che du cuivre et de ses alliages I. Influencc de la tempbratwe sur I'oxydation isochroiic du cuivre pur F. BOUILLON (Bruxelles) SC'MMAHY. --Elcctropolished samples of copper were kept in contact with dry oxygen under atmospheric pressure, a t temperatures ranging from 1000 to 9000 C.These were all examined under the microscope, by electron diffraction and in some L'BSCS by X ray, diffraction and with .an' electron microscope. They were also analyshed qualitatively and quantitatively, by Miley's clertrochemical method.It was shown that the direct oxidation of copper always ledd to cuprous oxide Cu,O. .4t temperatures higher than 224O C cuprous oxide was in its turn oxidized to cupric oxide CuO. Above 3 1 V C the rate of oxidation was so great that cuprous oxide could no longer be detected in the films.It appeared also that the first layers of cuprous oxide had a strong [111] orientation, which disappeared as soon as film thickness reached about 7 W A . At first 'it was randomly orientated, but recrystallized as it thickened, and finally showed, in very thick films, a very marked orientation.Finally i t was shown that the beginning of scalling coincided with the first appearance of cupric oxide but disapeared for temperatures higher than 8 O O o C .Oxide films were formed.Cupric oxide behaved in a quite different manner.