2010
DOI: 10.1016/j.cirp.2010.03.058
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Suppression mechanism of tool wear by phosphorous addition in diamond turning of electroless nickel deposits

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Cited by 19 publications
(10 citation statements)
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“…Presently, there is a lack of reliable method for the evaluation of graphite and diamond in the nanoscale simulation of diamond cutting. With the aid of molecular dynamics simulation, the in-depth understanding of the graphitization mechanism of diamond, especially knowing the graphitization behavior considering its application on cutting tool is of great significance to fully explore the advance of diamond machining technique [ 12 - 14 ].…”
Section: Introductionmentioning
confidence: 99%
“…Presently, there is a lack of reliable method for the evaluation of graphite and diamond in the nanoscale simulation of diamond cutting. With the aid of molecular dynamics simulation, the in-depth understanding of the graphitization mechanism of diamond, especially knowing the graphitization behavior considering its application on cutting tool is of great significance to fully explore the advance of diamond machining technique [ 12 - 14 ].…”
Section: Introductionmentioning
confidence: 99%
“…高純度グラファイトを超高圧・高温の条件下でダイヤモンドに直接変換したナノ多結晶ダイヤモンド(Nano Polycrystalline Diamond: NPD) (1) は,単結晶ダイヤモンドより硬いだけでなく,へき開性を持っていない.したがっ て,ビッカース硬さが 1 000 Hv 以上の高硬度材料に対して超精密切削加工を行うことができる次世代の工具素材 として期待される (2) (3) ,この脆弱層が機 械的なアブレーション作用によって除去されるといった現象が起こり得ると考えられた.また,砥石研削点の温 度が高い場合には酸化・還元反応 (4) の他に NPD の表面に熱変質層 (2), (4) が生成され,この熱変質層が機械的なアブ レーション作用によって除去されるといった現象も起こり得ると考えられた. 表 1 に示しているのは,本研究で使用した 9 種類の遷移金属とその物性である.他の原子から電子を引きつけ る強さを表す電気陰性度 (5) と,d 軌道を満たしている電子の飽和度を表す d 電子飽和度 (6), (7) との関係は図 1 のよう…”
Section: 緒 言unclassified
“…The processing technologies for reducing chemical activity between the tool and the workpiece materials include: gas protection cutting [19], cold plasma assisted cutting [29,30], carbon particle protection cutting [31], liquid nitrogen cooling cutting [20], ultrasonic vibration assisted cutting [21], and highly intermittent cutting [32]. Processes that avoid direct contact between the tool and the substrate include: diamond surface coating [23], surface nitriding/phosphorus in workpiece material [24,33,34], as shown in table 1. In addition, researchers also introduced multi-physics energy fields, such as magnetic fields and electric fields in cutting processing [35].…”
Section: Introductionmentioning
confidence: 99%