Suppressing the growth of interfacial Cu–Sn intermetallic compounds in the Sn–3.0Ag–0.5Cu–0.1Ni/Cu–15Zn solder joint during thermal aging

Chen, Wei-Yu; Yu, Chi-Yang

doi:10.1007/s10853-012-6254-0

Cited by 28 publications

(8 citation statements)

References 20 publications

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“…(3) At the CueZn side, the growth of L-(Cu,Ni) 6 (Sn,Zn) 5 was suppressed by the accumulation of Zn at the interface. Ni in the L-(Cu,Ni) 6 (Sn,Zn) 5 obstructed the diffusion of Zn out of the CueZn substrate, as reported in the literature [13]. The increase of Zn concentration gradually formed a Zn-rich layer between the L-(Cu,Ni) 6 (Sn,Zn) 5 IMC and the CueZn substrate.…”

Section: The Suppression Mechanism Of Imcs Growthsupporting

confidence: 66%

Suppressing the growth of Cu–Sn intermetallic compounds in Ni/Sn–Ag–Cu/Cu–Zn solder joints during thermal aging

Chen

2012

Intermetallics

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Section: The Suppression Mechanism Of Imcs Growthsupporting

confidence: 66%

Suppressing the growth of Cu–Sn intermetallic compounds in Ni/Sn–Ag–Cu/Cu–Zn solder joints during thermal aging

Chen

2012

Intermetallics

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“…The growth of the Cu 6 Sn 5 IMC layer is mainly determined by the diffusion of Cu atoms (from the substrate) into the molten Figure 8 Schematic of IMC formation at the solder/substrate interface and at bulk solder. Different concentration gradients of Cu at the interface encourage the diffusion of Cu (Chen et al, 2012). The longer cooling time (at the oven-and air-cooled solder joints) caused prolonged diffusion of the Cu, which induced the growth of the Cu 6 Sn 5 IMC layer [Figures 8(a) and 8(b)].…”

Section: Mechanism Of Intermetallic Formation Under Different Cooling Conditionsmentioning

confidence: 99%

Selective etching and hardness properties of quenched SAC305 solder joints

Yahaya

Salleh

Kheawhom

et al. 2020

SSMT

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Purpose The purpose of this paper is to investigate the morphology of intermetallic (IMC) compounds and the mechanical properties of SAC305 solder alloy under different cooling conditions. Design/methodology/approach SAC305 solder joints were prepared under different cooling conditions/rates. The performance of three different etching methods was investigated: simple chemical etching, deep etching based on the Jackson method and selective removal of β-Sn by a standard three-electrode cell method. Phase and structural analyses were conducted by X-ray diffraction (XRD). The morphology of etched solder was examined by a field emission scanning electron microscope. The hardness evaluations of the solder joints were conducted by a Vickers microhardness tester. Findings The Ag3Sn network was significantly refined by the ice-quenching process. Further, the thickness of the Cu6Sn5 layer decreased with an increase in the cooling rate. The finer Ag3Sn network and the thinner Cu6Sn5 IMC layer were the results of the reduced solidification time. The ice-quenched solder joints showed the highest hardness values because of the refinement of the Ag3Sn and Cu6Sn5 phases. Originality/value The reduction in the XRD peak intensities showed the influence of the cooling condition on the formation of the different phases. The micrographs prepared by electrochemical etching revealed better observations regarding the shape and texture of the IMC phases than those prepared by the conventional etching method. The lower grain orientation sensitivity of the electrochemical etching method (unlike chemical etching) significantly improved the micrographs and enabled accurate observation of IMC phases.

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“…Numerous research groups have studied interfacial reactions between Sn, Sn-Ag-Cu, and Sn-Zn alloys with Cu. [4][5][6][7][8][9][10][11][12][13][14][15][16][17][18][19][20] However, the literature on the interfacial reactions between lead-free solders and Alloy 25 is lacking. Therefore, the interfacial reactions with three liquid/solid Sn/Alloy 25, Sn-3.0 wt.% Ag-0.5 wt.% Cu/Alloy 25, and Sn-9 wt.% Zn/Alloy 25 couples were carried out at different temperatures for various time periods.…”

Section: Introductionmentioning

confidence: 99%

Interfacial Reactions in Lead-Free Solder/Cu-2.0Be (Alloy 25) Couples

Chang

Pasana

et al. 2021

Journal of Elec Materi

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The interfacial reactions between lead-free solders Sn, Sn-3.0 wt.% Ag-0.5 wt.% Cu (SAC) and Sn-9 wt.% Zn (SZ), and Cu-2.0 wt.% Be (Alloy 25) were investigated using the liquid/solid couple technique. The couples were reacted at 240-270°C for 0.5-10 h. The results revealed that only the scallop-shaped (Cu, Be) 6 Sn 5 phase was formed at 240°C for 0.5-2 h in the Sn/Alloy 25 couple. At a longer time (> 4 h) or higher temperature (255°C and 270°C), the (Cu, Be) 3 Sn phase was observed at the interface. In the SAC/Alloy 25 couple, the results were similar to that in the Sn/Alloy 25 couples. Only the scallopshaped (Cu, Be, Ag) 6 Sn 5 phase was formed for the short reaction time or at lower reaction temperature. With increasing reaction times and temperatures, both the (Cu, Be, Ag) 6 Sn 5 and (Cu, Be, Ag) 3 Sn phases were observed at the SAC/Alloy 25 interface. In the SZ/Alloy 25 couple, the (Cu, Sn)Zn 5 and (Cu, Sn) 5 Zn 8 phases were observed. Of these three couples, the intermetallic compound (IMC) thickness obeyed the parabolic law, and the IMC growth mechanism was diffusion-controlled.

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Suppressing the growth of interfacial Cu–Sn intermetallic compounds in the Sn–3.0Ag–0.5Cu–0.1Ni/Cu–15Zn solder joint during thermal aging

Cited by 28 publications

References 20 publications

Suppressing the growth of Cu–Sn intermetallic compounds in Ni/Sn–Ag–Cu/Cu–Zn solder joints during thermal aging

Suppressing the growth of Cu–Sn intermetallic compounds in Ni/Sn–Ag–Cu/Cu–Zn solder joints during thermal aging

Selective etching and hardness properties of quenched SAC305 solder joints

Interfacial Reactions in Lead-Free Solder/Cu-2.0Be (Alloy 25) Couples

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