Suppressing spinodal decomposition by adding Co into Cu–Ni–Si alloy

Xiao, Xiangpeng; Yi, Zhen; Chen, Tingting; Liu, Ruiqing; Wang, Hang

doi:10.1016/j.jallcom.2015.11.103

Cited by 70 publications

(16 citation statements)

References 22 publications

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“…The presence of doped cobalt reduced the tendency towards spinodal decomposition because the solid solubility of cobalt in copper is lower than nickel's, and cobalt is likely to bind to available vacancies. As a result, the movement of vacancies required by spinodal decomposition was inhibited [4], and the quantity of cobalt-containing vacancies decreased dramatically in the C7035 alloy. This further inhibited the glide of mobile dislocations and improved the anti-stress relaxation capacity.…”

Section: Discussionmentioning

confidence: 99%

“…C7025 alloys are widely used in the fabrication of conductor components and lead frame materials due to their excellent strength and conductivity [1][2][3]. However, C7035 alloys have higher strength, electrical conductivity and more appropriate stress relaxation properties [4,5]. The quality of materials used to construct lead frames and the conductors in components can be determined by their elastic limit and relaxation stability.…”

Section: Introductionmentioning

confidence: 99%

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Stress Relaxation Properties and Microscopic Deformation Structure in Bending of the C7025 and C7035 Alloy

Xiao

Huang

et al. 2018

Crystals

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Stress relaxation tests in cantilever bending were performed on the C7025 and C7035 alloys at 298 K and 393 K, respectively. The effect of stress-relief treatments on stress relaxation properties was investigated. The structural changes associated with the stress relaxation process were examined using transmission electron microscopy. The stress relaxation curve fits well to empirical formula σ* = [K'ln(t + α 0 ) + C] −n for stress relaxation. The curves can be split into two stages. The stress drops fast at first and then it gets slower in the second stage, and tends towards a certain limited value after a long time. The curve and microstructure reveal that the C7035 alloy has a lower rate of stress relaxation and a higher anti-stress relaxation capacity than the C7025. The first reason is that the movement of vacancies required by spinodal decomposition is inhibited, and the quantity of cobalt-containing vacancies decreases dramatically in the C7035 alloy. The other reason is that the precipitated phases became uniformly diffused in the C7035 alloy. The precipitate phase is uniformly distributed in the grain boundaries and the matrix, during the relaxed condition, and thus the dislocation movement is blocked by the precipitate.Crystals 2018, 8, 324 2 of 10 room temperature, and considered that the recovery and relaxation process was similar, which results in dislocation migration, dislocation rearrangement, and dislocation annihilation. The stress relaxation behavior of beryllium copper was studied by Li Yilian [10]. Due to the effect of elastic stress, beryllium atomic uphill diffusion occurs, Guinier Preston zone (G.P.) areas are formed, thus improving the stress relaxation and stabilty performance of the alloy at room temperature. It is important to characterize the stress relaxation behavior of elastic copper alloy not only in terms of the remaining stress after exposure to elevated temperatures, but also in terms of microstructural changes. The purpose of this paper is to present the results of low temperature stress relaxation tests performed with C7025 and C7035 alloys and attempt to ascertain the mechanism of microscopic deformation. Experimental SectionThe materials selected for this study were C7025 and C7035 alloys in the form of plates with a thickness of 0.3 mm in a cold-rolled condition. The chemical composition of the alloys is shown in Table 1. Stress relaxation testing was carried out according to ASTM E328-2002(2008) standard method for plate products. The specimens for stress relaxation (Figure 1) were cut parallel to the rolling direction of the plate, using spark machinery from stock samples. A machine or system for special use has been developed to conduct the stress relaxation tests for plate ( Figure 2). The configuration of the system is described in Reference [11] in detail. The stress relaxation was performed in a furnace at the test temperature. The temperature was monitored by a thermocouple placed in the grips near the specimen and the temperature was controlled to within ±1 K du...

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Section: Discussionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Stress Relaxation Properties and Microscopic Deformation Structure in Bending of the C7025 and C7035 Alloy

Xiao

Huang

et al. 2018

Crystals

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“…The presence of doped cobalt reduced the tendency towards spinodal decomposition because the solid solubility of cobalt in copper is lower and cobalt is likely to bind to available vacancies. As a result, the movement of vacancies required by spinodal decomposition was inhibited [4], and the quantity of cobalt-containing vacancies decreased dramatically in the C7035 alloy. This further inhibited the glide of mobile dislocations and improved the anti-stress relaxation capacity.…”

Section: Discussionmentioning

confidence: 99%

Stress Relaxation Properties and Microscopic Deformation Structure in Bending of the C7025 and C7035 Alloy

Xiao¹,

Xu²,

Huang³

et al. 2018

Preprint

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Stress relaxation tests in cantilever bending were performed on the C7025 and C7035 alloys at 298K and 393K，respectively. The effect of stress-relief treatments on stress relaxation properties was investigated. The structural changes associated with the stress relaxation process were examined using transmission electron microscope. The stress relaxation curve fits well to empirical formula σ*=[Kˊln(t+α0)+C]-n for stress relaxation. The curves can be split into two stages. The stress relax quickly in the first stage, slows down in the second stage, and tends to be a certain limit value after a long time. The curve and microstructure reveals that the C7035 alloy has a lower rate of stress relaxation and a higher anti-stress relaxation capacity than the C7025. The first reason is that the movement of vacancies required by spinodal decomposition is inhibited, and the quantity of cobalt -containing vacancies decreases dramatically in the C7035 alloy. The other reason is that the precipitated phases became uniformly diffused in the C7035 alloy. The precipitate phase uniformly distributes in the grain boundaries and the matrix, during the relaxed condition, and thus the dislocations moving is blocked by the precipitates.

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“…Age-hardenable Cu-based alloys, which have good mechanical and electrical properties, are widely used in components of various electronic devices, such as connectors, relays, and switches [1][2][3][4][5][6][7]. Recent rapid advances of densely-integrated and the reductions in size and thickness of electronic components have led to more severe requirements for excellent mechanical and electrical properties of the Cu-based alloys.…”

Section: Introductionmentioning

confidence: 99%

“…Cu-3Ti to 0.809 kΩ•cm 2 , indicating a faster corrosion rate. A more uniform potential was obtained on the surface of the Cu-Ti-Fe-Cr alloy, due to the more uniform distribution and smaller size of the (FeCr) 2 Ti phase.…”

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confidence: 97%

Effects of Trace Alloying Elements Fe and Cr on the Microstructure and Aging Properties of Cu-3Ti Alloy Foils

Zhao

Dong

et al. 2018

Metals

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In this work, the effects of an addition of trace alloying elements, Fe and Cr, on the mechanical and electrical properties and corrosion resistance of Cu-3Ti alloy foils, have been investigated. The results showed that the individual addition of Fe leads to the formation of Fe2Ti intermetallic phase, which refines the grain size, in the solution-treated condition. With a combined addition of Fe and Cr, the formation of the (FeCr)2Ti phase and the precipitation of the β′-Cu4Ti phase resulted in increased hardness in the peak-aged condition. The ultimate tensile strength and yield strength of the peak-aged Cu-Ti-Fe-Cr alloy were 13% and 5.7% higher, than those of the Cu-3Ti alloy, respectively. The electrical conductivity of the peak-aged Cu-Ti-Fe-Cr alloy was 3.3% higher than that of the Cu-Ti-Fe alloy, due to the finer (FeCr)2Ti phase and the less residual Ti atoms, in the Cu matrix. The combined addition of Fe and Cr elements could improve the corrosion resistance of the Cu-Ti alloy. The Cu-Ti-Fe-Cr alloy foil could obtain the best integrated properties, and the hardness, ultimate tensile strength, and electrical conductivity were 357.1 HV, 1068 MPa and 12.5% IACS, respectively.

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Suppressing spinodal decomposition by adding Co into Cu–Ni–Si alloy

Cited by 70 publications

References 22 publications

Stress Relaxation Properties and Microscopic Deformation Structure in Bending of the C7025 and C7035 Alloy

Stress Relaxation Properties and Microscopic Deformation Structure in Bending of the C7025 and C7035 Alloy

Stress Relaxation Properties and Microscopic Deformation Structure in Bending of the C7025 and C7035 Alloy

Effects of Trace Alloying Elements Fe and Cr on the Microstructure and Aging Properties of Cu-3Ti Alloy Foils

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