Successive breakdown mode of time-dependent dielectric breakdown for Cu interconnects and lifetime enhancement under dynamic bias stress

Lee, Sol-Kyu; Jang, Kyung-Uk; Yi, Seol-Min; Joo, Young‐Chang

doi:10.1109/irps.2018.8353578

2018 IEEE International Reliability Physics Symposium (IRPS) 2018

DOI: 10.1109/irps.2018.8353578

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Successive breakdown mode of time-dependent dielectric breakdown for Cu interconnects and lifetime enhancement under dynamic bias stress

Sol-Kyu Lee

Kyung-Uk Jang

Seol-Min Yi

et al.

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Successive breakdown mode of time-dependent dielectric breakdown for Cu interconnects and lifetime enhancement under dynamic bias stress

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References 23 publications

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