Subtractive offset printing for fabrication of sub micrometer scale electrodes with gold nanoparticles

Tanaka, Masanobu; Mabuchi, Youji; Hayashi, T.; Hara, Masahiko

doi:10.1016/j.mee.2012.02.023

Cited by 15 publications

(16 citation statements)

References 20 publications

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“…Less interface oxidation is expected to occur for these materials due to the weaker oxygen affinity of the constituting metal atoms (Si, In, and Sn) when compared to Al. Another potential mechanism contributing to the patterning process could be caused by PDMS oligomers transferring from the blanket surface to the top of the polymer layer, 5 which could, in turn, lower the adhesion of the deposited material on top of the polymer resist. By comparing the Fourier transform infrared (FTIR) spectrum measured from the fabricated PDMS blanket and the ROP-processed polymer layer ( Figure S4d ), it is evident that no signs of PDMS oligomer transfer were detected.…”

Section: Resultsmentioning

confidence: 99%

“…Novel printing methods such as micro-contact printing (μ-CP), 1 high-resolution gravure, 2 adhesion contrast planography, 3 and reverse-offset printing (ROP) 4 have advanced the minimum attainable line resolution toward micrometer-level printing, hence well beyond that available with conventional printing methods such as gravure, flexography, and inkjet printing (>30 μm). From these high-resolution printing methods, ROP in particular shows great promise for the fabrication of electronic components and circuits as it can deliver high-quality patterns with a submicrometer printing resolution, 5 micrometer-level overlay printing accuracy, 6 uniform layer thickness, and rectangular cross section with steep sidewalls, thus producing features resembling those obtained with photolithography. 4 However, there is a fundamental dearth in the availability of electronic materials as printable inks, which limits the more universal utilization of printing methods in electronics manufacturing.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Reverse-Offset Printing of Polymer Resist Ink for Micrometer-Level Patterning of Metal and Metal-Oxide Layers

Sneck

Ailas

Gao

et al. 2021

ACS Appl. Mater. Interfaces

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Printed electronics has advanced during the recent decades in applications such as organic photovoltaic cells and biosensors. However, the main limiting factors preventing the more widespread use of printing in flexible electronics manufacturing are (i) the poor attainable linewidths via conventional printing methods (≫10 μm), (ii) the limited availability of printable materials ( e.g. , low work function metals), and (iii) the inferior performance of many printed materials when compared to vacuum-processed materials ( e.g. , printed vs sputtered ITO). Here, we report a printing-based, low-temperature, low-cost, and scalable patterning method that can be used to fabricate high-resolution, high-performance patterned layers with linewidths down to ∼1 μm from various materials. The method is based on sequential steps of reverse-offset printing (ROP) of a sacrificial polymer resist, vacuum deposition, and lift-off. The sharp vertical sidewalls of the ROP resist layer allow the patterning of evaporated metals (Al) and dielectrics (SiO) as well as sputtered conductive oxides (ITO), where the list is expandable also to other vacuum-deposited materials. The resulting patterned layers have sharp sidewalls, low line-edge roughness, and uniform thickness and are free from imperfections such as edge ears occurring with other printed lift-off methods. The applicability of the method is demonstrated with highly conductive Al (∼5 × 10 –8 Ωm resistivity) utilized as transparent metal mesh conductors with ∼35 Ω □ at 85% transparent area percentage and source/drain electrodes for solution-processed metal-oxide (In 2 O 3 ) thin-film transistors with ∼1 cm 2 /(Vs) mobility. Moreover, the method is expected to be compatible with other printing methods and applicable in other flexible electronics applications, such as biosensors, resistive random access memories, touch screens, displays, photonics, and metamaterials, where the selection of current printable materials falls short.

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Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Reverse-Offset Printing of Polymer Resist Ink for Micrometer-Level Patterning of Metal and Metal-Oxide Layers

Sneck

Ailas

Gao

et al. 2021

ACS Appl. Mater. Interfaces

View full text Add to dashboard Cite

show abstract

“…Reverse‐offset printing enables high‐resolution patterning, high throughput, and scalability with a feature line width and space of 5 µm . This technique can be divided into three parts: first, ink is coated on a silicone blanket (coating step); second, the ink‐coated blanket is pressed softly onto an engraved glass surface to remove unnecessary areas of ink (patterning step); finally, the partially dried ink pattern remaining on the blanket is transferred to a substrate (transfer step) ( Figure a).…”

Section: High‐resolution Printing Technologiesmentioning

confidence: 99%

Recent Progress in the Development of Printed Thin‐Film Transistors and Circuits with High‐Resolution Printing Technology

2016

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Printed electronics enable the fabrication of large‐scale, low‐cost electronic devices and systems, and thus offer significant possibilities in terms of developing new electronics/optics applications in various fields. Almost all electronic applications require information processing using logic circuits. Hence, realizing the high‐speed operation of logic circuits is also important for printed devices. This report summarizes recent progress in the development of printed thin‐film transistors (TFTs) and integrated circuits in terms of materials, printing technologies, and applications. The first part of this report gives an overview of the development of functional inks such as semiconductors, electrodes, and dielectrics. The second part discusses high‐resolution printing technologies and strategies to enable high‐resolution patterning. The main focus of this report is on obtaining printed electrodes with high‐resolution patterning and the electrical performance of printed TFTs using such printed electrodes. In the final part, some applications of printed electronics are introduced to exemplify their potential.

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“…Device interactions refer to the micro-and nanoscales, creating devices that will interact with cells on the microlevel which potentially alleviate extreme damage to entire tissues or even organs and reduce inflammatory response while better targeting and treating the problem [16][17][18]. This kind of device-(biomaterial-) cell interaction performance has promoted wide application of various nanomaterials in biomedicine and biology [19][20][21][22], such as gold [23,24] or SiO 2 -gold nanoshells [25], water-soluble polymers [26], hydrogels [27], starch-based powders [28], and fibrins [16,29]. These biomaterials have been used for fabricating different medical devices including neuron-adhesive patterns [30,31], collagen scaffolds [32,33], synthetic biodegradable scaffolds [34][35][36], and fibrin channels [27].…”

Section: Introductionmentioning

confidence: 99%

Application and Performance of 3D Printing in Nanobiomaterials

Liu

et al. 2013

Journal of Nanomaterials

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3D printing (3DP) is becoming a research and development focus in nanobiomaterials as it can quickly and accurately fabricate any desired 3D tissuemodel only if itssize is appropriate. The different material powders (with different dimensional scales) and the printing strategies are the most direct factors influencing 3DP quality. With the development of nanotechnologies, 3DP is adopted more frequently for its rapidness in fabrication and precision in geometry. The fabrication in micro/nanoscale may change the performance of biomaterials and devices because it can retain more anisotropy of biomaterials compared with the traditionally rapid prototyping techniques. Thus, the biosafety issue is especially concerned by many researchers and is investigated in performance and safety of biomaterials and devices. This paper investigates the performance of 3DP in fabrication of nanobiomaterials and devices so as to partially explain how 3DP influences the performance and safety of nanobiomaterials.

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Subtractive offset printing for fabrication of sub micrometer scale electrodes with gold nanoparticles

Cited by 15 publications

References 20 publications

Reverse-Offset Printing of Polymer Resist Ink for Micrometer-Level Patterning of Metal and Metal-Oxide Layers

Reverse-Offset Printing of Polymer Resist Ink for Micrometer-Level Patterning of Metal and Metal-Oxide Layers

Recent Progress in the Development of Printed Thin‐Film Transistors and Circuits with High‐Resolution Printing Technology

Application and Performance of 3D Printing in Nanobiomaterials

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