Substrate Thickness Optimization in Multi-Material Single Lap Adhesive Joints
Saratchandra Kundurthi,
Mahmoodul Haq
Abstract:Adhesive bonding of dissimilar materials introduces stress concentrations due to stiffness mismatch between the substrates, thereby exacerbating the peel and shear stresses leading to premature failures in single lap configurations. This work demonstrates that the stress distribution can be improved by decreasing the thickness of the stiffer substrate; and presents a structured approach to find the optimum thickness to improve overall joint performance. First, the critical stress components and critical locati… Show more
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