Substrate Testing on a Multi-Site/Multi-Probe ATE

Ma, Xiaojun; Lombardi, Fabrizio

doi:10.1007/s10836-007-5038-y

Cited by 5 publications

(4 citation statements)

References 24 publications

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“…Furthermore, we can acquire sufficient information on capacitance to detect any short faults without testing, though we must test all the wires to detect open faults. We therefore usually have only to detect open faults (7) .…”

Section: Open Faults Short Faults Near-open Faults and Near-short mentioning

confidence: 99%

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A Local Search Algorithm for Large-Scale MCM Substrate Testing

Murakami

2013

JAMDSM

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A multi-chip module substrate is designed for packing two or more semiconductor chips. On a substrate, there may exist two types of faults; one in a wiring and the other at an intersection of two wires, called via, and the faults must be detected. The testing is performed by a pair of probes, which touch the two ends of an inter-chip wiring. The completion time of the whole testing is the time when it has been confirmed that no fault exists on the substrate. A two-probe routing problem is considered to design efficient routes of the two probes for minimizing the completion time of the whole testing. In this paper, the two-probe routing problem is formulated as a constrained shortest path problem, and a heuristic algorithm by local search techniques is proposed. Computational experiments demonstrate that the proposed heuristic algorithm outperforms a known two-phase heuristic.

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Section: Open Faults Short Faults Near-open Faults and Near-short mentioning

confidence: 99%

“…Because of the high-density assembly, MCM has some advantages in terms of power consumption, package volume, and so on (4) . However, high-density assembly causes faults on MCM substrates (5) - (7) . These faults are classified as…”

Section: Introductionmentioning

confidence: 99%

A Local Search Algorithm for Large-Scale MCM Substrate Testing

Murakami

2013

JAMDSM

View full text Add to dashboard Cite

show abstract

“…Because of the high-density assembly, MCM has several advantages in terms of power consumption, package volume, and so on [4]. However, high-density assembly causes faults on MCM substrates [5][6][7][8]. These faults are classified as open faults, short faults, near-open faults, and near-short faults (Fig.…”

Section: Introductionmentioning

confidence: 99%

“…Furthermore, we can acquire sufficient information on capacitance to detect any short faults, even though we must test all the wires to detect open faults. We therefore usually have only to detect open faults [8].…”

Section: Introductionmentioning

confidence: 99%