Substrate temperature effects on the peel behavior of temporary pavement marking tapes

Son, Hyeyoung; Erk, Kendra A.; Davis, Chelsea S.

doi:10.1080/00218464.2021.2008369

Cited by 3 publications

(2 citation statements)

References 23 publications

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“…In another recent work, Son et al [33] studied PSAs used in temporary pavement marking, which, if peeled off, can lead to automotive accidents. Understanding how adhesive properties change with environmental conditions (e.g.…”

Section: Pressure-sensitive Adhesives (Psas)mentioning

confidence: 99%

From fundamental concepts to recent developments in the adhesive bonding technology: a general view

Borges

Akhavan‐Safar

Tsokanas

et al. 2023

Discov Mechanical Engineering

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Adhesive bonding is a constantly developing technique, and the volume of its industrial applications is rapidly increasing, which, in turn, requires improving the compatibility and performance of joining methods in specific applications. The industrial growth of adhesive bonding has also been linked to the broader implementation of composite materials and the increasing number of applications requiring joining dissimilar materials. Compared to traditional joining methods, adhesive bonding does not require local heating of the substrates or introducing holes or notches to them. It is instead a continuous joining method that promotes fewer regions of discontinuities and uniformity of the stress fields. Due to the industrial interest in this method, a substantial effort has been made to expand its range of applications and to provide the design tools that ensure it is a safe, reproducible, reliable, and durable process. The adhesive bonding research field is broad, ranging from adhesive formulation to evaluation of the final bonded structure. The present paper collects the relevant literature and discusses fundamental concepts and recent developments in the adhesive bonding technology, covering three essential topics: adhesive materials, joint designs and joint manufacturing methods, and joint modelling methods. Citing a wealth of relevant review papers, original papers, and book chapters, the paper intends to provide a coherent view of the state of the art, so the reader can identify the opportunities originating from the recent progresses in adhesive bonding.

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Section: Pressure-sensitive Adhesives (Psas)mentioning

confidence: 99%

From fundamental concepts to recent developments in the adhesive bonding technology: a general view

Borges

Akhavan‐Safar

Tsokanas

et al. 2023

Discov Mechanical Engineering

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show abstract

“…[10][11][12] Despite its benefits, the use of adhesives has some important drawbacks, being one of the most important high sensitivity to severe environmental conditions. Many authors have studied the effects of different environmental and loading conditions such as temperature, [13][14][15] ageing, [16][17][18] and fatigue [19][20][21][22] on the mechanical performance of bonded joints. The effect of temperature on adhesive joints is a relevant research topic since service temperatures are in practice often below or above the standard room conditions.…”

Section: Introductionmentioning

confidence: 99%

The role of loading mode on the property degradation of adhesives at high temperatures

Lopes

Akhavan‐Safar

Carbas

et al. 2023

Fatigue Fract Eng Mat Struct

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Despite existing studies on the effects of temperature on the behavior of bonded joints, the role of loading mode and test type (strength, fatigue, and fracture tests) on the rate of degradation of adhesive/joint properties at high temperatures has not been adequately investigated. The aim of the current study is to determine if adhesives experience the same rate of degradation at high temperature when they are subjected to different mode mixities. To do so, an epoxy adhesive was subjected to strength, fracture, and S–N fatigue tests, for modes I and II, at different temperatures. The results show that there is a significant difference between the rate of degradation in mode I/tensile and mode II/shear loading conditions. It was also found that the rate of degradation in adhesive properties is a function of test type. Based on the results, by increasing the temperature, a less reduction in tensile strength was found in the Arcan joints (almost 50% reduction) compared with the dogbone specimen (where the strength was reduced by less than 40%). According to the results, for all the considered tests, temperature sensitivity was more noticeable in tensile loading conditions compared with the shear mode. It is shown that despite the reduction in tensile fracture energy with temperature (by around 23%), the shear fracture energy was improved (by over 20%) at 50°C. Based on these results, an S–N model was also developed to create a master S–N curve, plotted as a function of temperature.

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A Holistic Approach to Exploring the Root Factors of Work Zone Accidents

Chammout,

Ahmed,

El-adaway

et al. 2024

J. Manage. Eng.

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Substrate temperature effects on the peel behavior of temporary pavement marking tapes

Cited by 3 publications

References 23 publications

From fundamental concepts to recent developments in the adhesive bonding technology: a general view

From fundamental concepts to recent developments in the adhesive bonding technology: a general view

The role of loading mode on the property degradation of adhesives at high temperatures

A Holistic Approach to Exploring the Root Factors of Work Zone Accidents

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