2019
DOI: 10.1002/adem.201900061
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Substrate Mediated Synthesis of Ti–Si–N Nano‐and‐Micro Structures for Optoelectronic Applications

Abstract: Being one of the strongest materials, ternary TiSiN exhibits a very interesting family of binary transition metal nitride and silicide systems. A novel technique to fabricate morphologically fascinating nano and micro structures of TiSiN is reported here. The referred TiSiN films, majorly constituted with cubic TiN phase, are enriched with crystalline nanoparticles, microflowers and faceted micro-crystals which possess attractive functionalities towards plasmon mediated optoelectronic applications. Reactivity … Show more

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Cited by 8 publications
(4 citation statements)
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“…Ti thin film deposited substrates were annealed at different annealing temperatures of about (820C, 780C & 750C) for 2 hours at a pressure less than 5 x 10 -8 Torr. During the annealing process, Ti transformed into TiN by the substrate mediated nitridation technique [18][19][20][21] where…”
Section: Methodsmentioning
confidence: 99%
“…Ti thin film deposited substrates were annealed at different annealing temperatures of about (820C, 780C & 750C) for 2 hours at a pressure less than 5 x 10 -8 Torr. During the annealing process, Ti transformed into TiN by the substrate mediated nitridation technique [18][19][20][21] where…”
Section: Methodsmentioning
confidence: 99%
“…While understanding the interaction between metallic Ti and the underneath Si3N4 substrate, one can use the high temperature annealing as an effective technique to fabricate the stable binary TiN and TiSi2 which further can contribute to the formation of ternary Ti-Si-N based composite materials having promising optoelectronic properties [11]. Depending on the external parameters like annealing temperature, film thickness, pressure etc., the preferential growth may occur between the nitride and silicide phases [6] and the majority phase dominates strongly over the minority so that distinctive characteristic properties from the former can be explored while keeping the latter unaffected.…”
Section: Introductionmentioning
confidence: 99%
“…We have used undoped Si (100) substrate covered with Si 3 N 4 dielectric spacer layer of 80 nm thickness. The Si 3 N 4 topping layer was grown by using low pressure chemical vapor deposition (LPCVD) technique and in this study, Si 3 N 4 is the only source of nitrogen for the nitridation of Ti to produce TiN thin films 54 56 . After following up the standard cleaning process of the substrates, Ti films were deposited on the substrate by dc magnetron sputtering using a Ti target of 99.995% purity in the presence of high purity Ar (99.9999%) gas.…”
Section: Methodsmentioning
confidence: 99%