Substrate-Independent Broad-Band Immersion Microlens Arrays with a High Coupling Efficiency for Infrared Focal Plane Arrays

Kang, Chang‐Mo; Bianconi, Simone; Hamilton, Travis; Rabinowitz, Jacob; Wheaton, Skyler; Liu, Lining; Ulmer, M. P.; Mohseni, Hooman

doi:10.1021/acsaelm.2c00109

Cited by 4 publications

(4 citation statements)

References 33 publications

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“…For example, we developed a new method of fabricating an array of solid‐immersion micro‐lenses directly on our focal‐plane arrays to improve the fill factor of nano‐photodetector devices. [ 103 ] To provide an accurate evaluation of the effect of the immersion lens array on the response of the detectors, each lensed detector on this array is surrounded by four bare reference detectors in a checkered pattern. These bare detectors provide the means for accurate comparison of the enhancement of device response due to the microlenses (Figure 19c).…”

Section: Photodetector Characterization Based On Roicmentioning

confidence: 99%

“…Recently, several groups have demonstrated new approaches in the integration of microlenses as an "immersion lens array" with such imaging sensors. [103,104] These methods are compatible with the realization of low-dimensional image sensors when the deposition of suitable dielectric layers on the low-dimensional material is possible. These approaches employ back-illuminated structures, where photons travel across a dielectric layer.…”

Section: Far-field Concentratorsmentioning

confidence: 99%

“…c) Checkered design of the micro lens array on a camera allows to quantify the 7.4 response improvement factor enabled by the micro lenses. Reproduced with permission [103]. Copyright 2022, American Chemical Society.…”

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confidence: 99%

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From Material to Cameras: Low‐Dimensional Photodetector Arrays on CMOS

et al. 2023

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The last two decades have witnessed a dramatic increase in research on low‐dimensional material with exceptional optoelectronic properties. While low‐dimensional materials offer exciting new opportunities for imaging, their integration in practical applications has been slow. In fact, most existing reports are based on single‐pixel devices that cannot rival the quantity and quality of information provided by massively parallelized mega‐pixel imagers based on complementary metal‐oxide semiconductor (CMOS) readout electronics. The first goal of this review is to present new opportunities in producing high‐resolution cameras using these new materials. New photodetection methods and materials in the field are presented, and the challenges involved in their integration on CMOS chips for making high‐resolution cameras are discussed. Practical approaches are then presented to address these challenges and methods to integrate low‐dimensional material on CMOS. It is also shown that such integrations could be used for ultra‐low noise and massively parallel testing of new material and devices. The second goal of this review is to present the colossal untapped potential of low‐dimensional material in enabling the next‐generation of low‐cost and high‐performance cameras. It is proposed that low‐dimensional materials have the natural ability to create excellent bio‐inspired artificial imaging systems with unique features such as in‐pixel computing, multi‐band imaging, and curved retinas.

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Section: Photodetector Characterization Based On Roicmentioning

confidence: 99%

Section: Far-field Concentratorsmentioning

confidence: 99%

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From Material to Cameras: Low‐Dimensional Photodetector Arrays on CMOS

et al. 2023

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“…Here, the operability is defined as the percentage of fully functional pixels with respect to all pixels in the FPA. While the fill factor issue can be addressed by using light concentrators as reported in several studies [15][16][17][18][19], the structural issue has not been addressed yet. Therefore, this study will focus mainly on the second challenge.…”

Section: Introductionmentioning

confidence: 99%

Toward sub-micron pixels for short-wave infrared imaging

Kang¹,

Rabinowitz²,

Bianconi³

et al. 2022

Semicond. Sci. Technol.

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The sensitivity of infrared imagers can be significantly improved by reducing the size of photodetectors down to the diffraction limit. Emerging low-dimensional material enable submicron photodetectors, which can be diffraction limited and lead to significant sensitivity improvement in the critical short-wave infrared band. However, reaching this limit requires pixel sizes smaller than the metal bumps needed for hybridization to silicon readout chips. Such tiny fragile pixels are susceptible to damages due to the mechanical pressure applied during flip-chip bonding, degrading the number of functional camera pixels. Herein, we systematically characterize the influence of the detector size on the imager pixel yield. We then introduce strategies for improving the yield of sub-micron pixels from less than half of total pixels to more than 3/4 of them. While we used a top-down fabrication for our detectors, the developed method is also applicable to bottom-up fabrication methods to make highly sensitive infrared cameras based on emerging low-dimensional material such as catalyst-assisted nanowires.

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Double-Band Metasurface Infrared Optics for Integrated Multichannel Spectral Sensors

Lai

Wang

et al. 2023

IEEE Sensors J.

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Simultaneously identifying the composition of mixtures and determining their concentration levels has aroused much attentions recent years to meet the large demands of compact and low-cost infrared spectral sensors to replace their conventional bulky counterparts with costly separated infrared components. In this work, we propose a design method for multichannel metasurface infrared array optics covering two bands (MWIR/LWIR) for construction of integrated infrared gas sensors. The use of metasurface microstructures with same height realizes the effective filtering and focusing of electromagnetic waves at multiple wavelengths in the both infrared bands, which is beneficial to decrease the manufacturing costs. Four-channel metasurface lens arrays and filter arrays with operating wavelengths of 3.5 μm, 9.7 μm, 10.6 μm and 3.9 μm corresponding to the infrared absorption peaks of three gases of ethanol, ammonia, ethylene and one reference wavelength respectively, were designed and produced by photolithographic patterning and dry etching processes on silicon substrates. The multi-channel metasurface infrared optics have the advantages of easy fabrication and integration with wide-band infrared detector array to form a compact infrared spectral detector, which meets the requirements of small volume and low cost to advanced infrared spectral sensors for applications in portable smart sensing systems and internet of things.

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Substrate-Independent Broad-Band Immersion Microlens Arrays with a High Coupling Efficiency for Infrared Focal Plane Arrays

Cited by 4 publications

References 33 publications

From Material to Cameras: Low‐Dimensional Photodetector Arrays on CMOS

From Material to Cameras: Low‐Dimensional Photodetector Arrays on CMOS

Toward sub-micron pixels for short-wave infrared imaging

Double-Band Metasurface Infrared Optics for Integrated Multichannel Spectral Sensors

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