Substrate-facilitated nanoparticle sintering and component interconnection procedure

Abstract

Room temperature substrate-facilitated sintering of nanoparticles is demonstrated using commercially available silver nanoparticle ink and inkjet printing substrates. The sintering mechanism is based on the chemical removal of the nanoparticle stabilizing ligand and is shown to provide conductivity above one-fourth that of bulk silver. A novel approach to attach discrete components to printed conductors is presented, where the sintered silver provides the metallic interconnects with good electrical and mechanical properties. A process for printing and chip-on-demand assembly is suggested.

Printing Conductive Nanomaterials for Flexible and Stretchable Electronics: A Review of Materials, Processes, and Applications

“…However, such a phenomenon did not happen on sticky note paper or copy paper . The large differences of resistance on different papers can be explained by the substantial differences in the surface coating properties of the different papers …”

Progress of alternative sintering approaches of inkjet-printed metal inks and their application for manufacturing of flexible electronic devices

“…97 The deposited ink contains acrylate monomers, which form a solid host scaffold for the PAA stabilized Ag NPs aer polymerization via UV irradiation. A sintering approach on the basis of silanol groups in combination with high humidity was reported by Allen et al 99 This approach is particularly interesting, since silica and alumina coatings are oen used as an ink receiving layer for paper substrates in the printing industry to accelerate the drying process. This is indeed much lower compared to previous work on electrolyte sintering, but shows one possible way to conductive 3D objects, fabricated by inkjet-printing in combination with a chemical sintering technique.…”

“…116,118 However, the requirement of directly contacting the printed pattern during sintering demonstrates an obstacle in large quantity fabrication. 99,121 Since electrical sintering can be carried out in a very selective manner, the fabrication of so-called Write Once Read Many (WORM) memory devices was performed (Fig. 119 An AC eld was applied by mobile electrodes, which were situated slightly above the sample (Fig.…”

Electrically conductive lines on cellulose nanopaper for flexible electrical devices

“…Because of the high-temperature processing at around 300-500 C, the devices must be fabricated on inorganic silicon or glass substrates, which have high thermal durability and low thermal expansion. 1,5,[10][11][12][13][14][15][16] In most commercialized papers, core substrates consisting of micro-sized cellulose pulp bers are covered with polymer-based materials. To fabricate exible electronic devices, the conductive patterns must be deposited on plastic substrates by metal sputtering or by printing with metal pastes or inks.…”

“…As a result, the devices are heavy and inexible because the electrically conductive patterns are mounted on weighty, rigid and fragile substrates. 5,14,15 Thus, we need to develop new paper substrates to realize lightweight and highly exible electronic devices. Printed patterns using metal pastes or inks have been attracting considerable attention as a key process because their processing temperatures have been dramatically decreased to around 200 C by recent technological advances.…”