2018
DOI: 10.1080/02670844.2017.1321265
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Substrate effect on electrodeposited copper morphology and crystal shapes

Abstract: Copper has been electrodeposited on copper (FCC) and mild steel (BCC) substrates from acidic sulphate bath with and without cetyl trimethyl ammonium bromide at 0.25, 2, 6 and 9 V. It is found that the surface morphology varies with the change in overpotential, but not with the change in substrate. On the contrary, the crystal shape is found to be independent of the applied overpotential, but varies with the bath chemistry or choice of substrate.

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Cited by 30 publications
(19 citation statements)
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“…When the competitive deposition was further carried out in the presence of silver, copper, and lead, the removal efficiency of lead (>80%) was much higher than the removal efficiency of copper (<20%), which was contrary to expectations based solely on reduction potentials ( Paul Chen and Lim, 2005 ). This result indicates that standard reduction potentials alone do not determine the composition of the deposit; other factors, such as metal concentration, pH, ionic strength, additives, the kind of substrate, chelating agents, mode of electrodeposition (chronoamperometry or chronopotentiometry), applied current signal, temperature, and fluid-dynamic conditions, all work together to determine the characteristics of deposition ( Banthia et al., 2017 ; Ibañez and Fatás, 2005 ; Kim et al., 2018a ; Maarof et al, 2017 ).…”
Section: Electrochemical Separations For Selective Recoverymentioning
confidence: 99%
“…When the competitive deposition was further carried out in the presence of silver, copper, and lead, the removal efficiency of lead (>80%) was much higher than the removal efficiency of copper (<20%), which was contrary to expectations based solely on reduction potentials ( Paul Chen and Lim, 2005 ). This result indicates that standard reduction potentials alone do not determine the composition of the deposit; other factors, such as metal concentration, pH, ionic strength, additives, the kind of substrate, chelating agents, mode of electrodeposition (chronoamperometry or chronopotentiometry), applied current signal, temperature, and fluid-dynamic conditions, all work together to determine the characteristics of deposition ( Banthia et al., 2017 ; Ibañez and Fatás, 2005 ; Kim et al., 2018a ; Maarof et al, 2017 ).…”
Section: Electrochemical Separations For Selective Recoverymentioning
confidence: 99%
“…A variety of metals, including nickel for the automotive industry and consumer products or on pistons and cylinder walls, chromium for hard coatings to improve wear resistance, cadmium, and zinc to improve corrosion resistance, can be electroplated on steel substrates. This method can also be used to coat precious metals such as silver and gold [23].…”
Section: Electrochemical Coatingsmentioning
confidence: 99%
“…Copper is a highly preferred electrochemical coating material due to its high electrical and thermal conductivity and relatively low price. In addition, it is quite easy to coat copper with the electrochemical method [23,24]. Copper can be coated on substrates with several methods such as PVD, CVD, electrodeposition, and electroless deposition.…”
Section: Copper Electrodepositionmentioning
confidence: 99%
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“…Lower overpotential favors growth in a layer-by-layer fashion, whereas higher overpotential promotes potential dendritic growth followed by multi-directional growth, similar to that of a cauliflower. Type of the substrate played a key role in the deposited crystal shape [115].…”
Section: Electrodeposition Techniquesmentioning
confidence: 99%