“…As nanostructures remain integrity when subject to a larger strain than their bulk counterparts, the strain engineering was treated as an effective way to improve the performance of nanostructure devices [7] . Normally, strain is introduced by lattice mismatch [8] , impurity doping [9] , functional wrapping [10] as well as direct mechanical applications [5,11] in strain engineering. Thanks to strain engineering, tremendous achievements have been made, such as the turn of indirect band gap to direct band gap [12] , band gap opening [13] , enhancement of charge carrier mobility [14] , tune of the effective mass of carriers [15] , and transition of semiconductors to conductors [16] .…”