2004
DOI: 10.1016/j.cpc.2004.02.011
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Subroutines for some plasma surface interaction processes: physical sputtering, chemical erosion, radiation enhanced sublimation, backscattering and thermal evaporation

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Cited by 46 publications
(39 citation statements)
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“…and are shown in Table 1 and Table 2, where most of these were used in MD or KMC simulations [14,15,16,25] and gleaned from either experiments (E D , E HD or an educated guess was used (like ω o corresponds to typical phonon frequency [19]). The backscattering rate R is from [27]. The simulated domain of the target is 3 µm, the thickness of the co-deposit is 2 µm, and incident HIs flux Γ 0 = 10 24 atoms.m −2 .s −1 , unless stated otherwise.…”
Section: Hydrogen Isotope Retention In Porous Materialsmentioning
confidence: 99%
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“…and are shown in Table 1 and Table 2, where most of these were used in MD or KMC simulations [14,15,16,25] and gleaned from either experiments (E D , E HD or an educated guess was used (like ω o corresponds to typical phonon frequency [19]). The backscattering rate R is from [27]. The simulated domain of the target is 3 µm, the thickness of the co-deposit is 2 µm, and incident HIs flux Γ 0 = 10 24 atoms.m −2 .s −1 , unless stated otherwise.…”
Section: Hydrogen Isotope Retention In Porous Materialsmentioning
confidence: 99%
“…The heating module is applied here to a Be/C/W materials wall, where the heating conductivity data is obtained from [26,27]. The wall thickness (distance of surface to the cool side) is L. The coolant temperature is fixed to T 0 = 400 K.…”
Section: The Temperature Distributionmentioning
confidence: 99%
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“…Third, Warrier et al [25] have published subroutines implementing existing models for sputtering, chemical erosion, radiation-enhanced sublimation, backscattering and evaporation. The intriguing aspect of their package is that it includes a routine for solving a 1-D heat diffusion equation so that the surface temperature can be estimated; the surface temperature is needed to evaluate the rates for chemical erosion, radiation-enhanced sublimation, and evaporation.…”
Section: Directions For Model Improvementmentioning
confidence: 99%