2021
DOI: 10.1107/s1600577520013211
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Submicronic Laue diffraction to determine in-depth strain in very closely matched complex HgCdTe/CdZnTe heterostructures with a 10−5 resolution

Abstract: Cross-sectional submicronic Laue diffraction has been successfully applied to HgCdTe/CdZnTe heterostructures to provide accurate strain profiles from substrate to surface. Combined with chemical-sensitive techniques, this approach allows correlation of lattice-mismatch, interface compositional gradient and strain while isolating specific layer contributions which would otherwise be averaged using conventional X-ray diffraction. The submicronic spatial resolution allowed by the synchrotron white beam size is pa… Show more

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Cited by 2 publications
(5 citation statements)
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References 26 publications
(32 reference statements)
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“…For this experiment, in order to study intercepted micro-Laue diffraction peaks in fine detail, we have used the same methodology as previously described by Biquard et al (2021). To summarize, first, the CCD camera is placed sufficiently far away from the sample ($290 mm) to induce a peak intensity distribution FWHM larger than 3 pixels.…”
Section: Discussionmentioning
confidence: 99%
See 3 more Smart Citations
“…For this experiment, in order to study intercepted micro-Laue diffraction peaks in fine detail, we have used the same methodology as previously described by Biquard et al (2021). To summarize, first, the CCD camera is placed sufficiently far away from the sample ($290 mm) to induce a peak intensity distribution FWHM larger than 3 pixels.…”
Section: Discussionmentioning
confidence: 99%
“…Since the two values are almost identical, the critical thickness for the HgCdTe layer with +0.02% compressive mismatch appears to be 2.0 AE 0.25 mm. This seems a reasonable value since the measured critical thickness for the tensile À0.02% mismatch is 2.5 AE 0.3 mm (Biquard et al, 2021). The critical thickness simply corresponds to the depth value of the minimum of the 2D IB, thus providing an elegant way to measure this fundamental value for any kind of epitaxial layer and even without the need for any flexion machine.…”
Section: D Ib Evolution In the Elastic Domainmentioning
confidence: 94%
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“…Today, the physical origin of defective photodiodes is the core of intense research. The investigation of epitaxial mismatch strain be-tween the MCT layer and CdZnTe (CZT) substrate [4] is of particular interest, as is the impact of the different processing steps throughout device fabrication such as etching, ion implantation, surface passivation, metallization and annealing [5,6] . Moreover, the thermal mismatch between MCT and Si readout circuit in 2D FPAs is another source of the defective photodiodes, since these sensors typically operate at 80 K [7][8][9][10] .…”
Section: Introductionmentioning
confidence: 99%