“…Therefore, often an all-dry process is desired from the manufacturing point of view (Kovalskiy et al, 2006). Generally, cF 4 and SF 6 + o 2 plasmas are used for chG or chG-ag binary system patterning, which behave as negative resist (Kostyukevych, 1998;Tai et al, 1980). notwithstanding, a way to obtain positive resist with Rie is proposed, where the as 33 S 67 -ag structure is dry etched in S plasma (Kozicki et al, 1991).…”