2017
DOI: 10.1016/j.jcrysgro.2017.09.002
|View full text |Cite
|
Sign up to set email alerts
|

Sublimation growth of bulk 3C-SiC using 3C-SiC-on-Si (1 0 0) seeding layers

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
2

Citation Types

0
19
0

Year Published

2018
2018
2024
2024

Publication Types

Select...
7
1

Relationship

0
8

Authors

Journals

citations
Cited by 22 publications
(29 citation statements)
references
References 17 publications
0
19
0
Order By: Relevance
“…The experimental setup, the calculation of the supersaturation, as well as a description of our transfer process, can be seen in Figure 1. A more detailed description can be found in [10,13]. The transfer of 3C seeding layers was conducted on four-inch wafers, featuring a thickness of approximately 20 µm for the epitaxial 3C layer, on 580 µm thick, highly n-doped, on-axis (100) silicon substrates.…”
Section: Experimental Methodsmentioning
confidence: 99%
See 1 more Smart Citation
“…The experimental setup, the calculation of the supersaturation, as well as a description of our transfer process, can be seen in Figure 1. A more detailed description can be found in [10,13]. The transfer of 3C seeding layers was conducted on four-inch wafers, featuring a thickness of approximately 20 µm for the epitaxial 3C layer, on 580 µm thick, highly n-doped, on-axis (100) silicon substrates.…”
Section: Experimental Methodsmentioning
confidence: 99%
“…Due to the misfit between 3C-SiC and silicon, the wafers are under a lot of stress, leading to bent or even cracked material. By transferring CVD-grown layers on a SiC carrier, a seeding stack can be produced, to perform subsequent growth by SE [10].…”
Section: Introductionmentioning
confidence: 99%
“…It has been shown previously that n-and p-type 3C-SiC epitaxial layers with thickness of 3-5 µm can be formed on SiC substrates of hexagonal polytypes (4H-SiC) by the method of sublimation in a vacuum [1][2][3][4]. The goal of the present study was to examine the radiation hardness of the epitaxial layers.…”
Section: Introductionmentioning
confidence: 94%
“…The used setup as well as numerical simulation data can be found in [11,14]. The manufacturing process, creating 3C-SiC-on-SiC seeding stacks, was done on four inch wafers featuring a thickness of approximately 20 µm for the epitaxial layer, on 580 µm-thick, highly n-doped, on-axis (100) silicon wafers.…”
Section: Experimental Methodsmentioning
confidence: 99%
“…Consequently, thickness presents limitations. By transferring CVD-grown layers on a SiC carrier, a seeding stack can be produced to achieve subsequent growth by SE [11]. Seeding material of high quality and a thickness close to 1 mm would allow enhanced bulk growth using methods like modified PVT (M-PVT) or continuous-feed PVT (CF-PVT), increasing the thickness even more [7,12,13].…”
Section: Introductionmentioning
confidence: 99%