Studying the Hall-Petch effect regarding sub-micrometer steel (0.6% C)

Baracaldo, Rodolfo Rodríguez; Marrero, José M. Cabrera; Páramo, Josep Antonio Benito

doi:10.15446/ing.investig.v31n3.26398

Cited by 2 publications

(1 citation statement)

References 23 publications

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“…Hence, with the statistics affordable and considering only the results of this nano-indenter measurement, we could not define, with absolute certainty, which parameter is determinant for the increasing or the decreasing of the hardness and of the reduced modulus. However we know, from literature, [20][21][22] that the hardness and the reduced modulus, increases when the average size of the grains are smaller. S 11 , has a minimum value of hardness, so, its microscopic morphology should be formed by a relative small number of big grains, while sample S 4 , that shows higher hardness and reduced modulus, should have a big number of grains of small size.…”

Section: D543mentioning

confidence: 99%

Characterization of Thick Film of Copper Electrodeposited for Cryogenic Applications

Fava

Lucci

Faso³

et al. 2014

J. Electrochem. Soc.

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We report on the characterization of electroformed copper. Different copper films have been deposited, on a brass rod, paying attention to modify only one parameter of the galvanic bath for each specimen (acidity, temperature, density of current, etc.). The samples obtained have been analyzed by residual resistivity ratio (RRR) to evaluated the electrical conductivity, with the nanoindenter to measure the hardness and the reduced modulus and with the X-ray diffraction to calculate the average dimensions of the grains. The comparative analysis of all the data gives us the set of parameters required to obtain a good electrical conductor, working at cryogenic temperatures and mechanically resistant.Copper was one of the first metals historically used and its success is due to its unique properties: 1 i. toughness; ii. ductility; iii. resistance to many corrosive environments; iv. high electrical conductivity and v. high thermal conductivity. The use of copper is widespread not only as pure metal, but also entering in alloys with various others metals, preserving good mechanical characteristics down to low temperatures. From the environmental point of view, copper is the less dangerous metal if compared to other metals used in the deposition processes. 1 Also the recycling treatments are well known and this helps to find the most suitable solutions for managing the handling of galvanic products and disposal of residuals linked to the electroplating activities. Compared to other metals, copper is one of the most used in the deposition processes. 2 Copper is an excellent substrate, when is mechanically polished, and its electrical conductivity, being second only to silver, makes it an excellent and inexpensive coating for printed circuit boards. 2 Furthermore it is suitable for covering surface defects like holes or splinters and it is used as an excellent buffer layer between the substrates and the subsequent deposits. The large use of Cu in electrical industry is mainly due to the possibility to deposit this material with different techniques. Among them, the electro-deposition method assures fast and low-cost depositions combined with a great repeatability. In addition to the huge number of applications, its good electrical properties -which improve at low temperature -make it one of the most used material in the electrical wire industry; in particular cases it can be coupled with brass (characterized by a lower thermal conductivity) and used in specific applications such as electrical connectors for high current superconducting devices. A thick film of copper on a brass support is often used for obtaining special current leads, with selected balancing at cryogenic temperatures between electrical resistance and total thermal conductivity between room temperature and cryogenic bath. 1,2,3 In this way it is possible to supply the required high currents, also minimizing the heat absorbed by the external environment and by the instrumentation from the cryogenic line. The use of brass, as internal support of a copper con...

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Section: D543mentioning

confidence: 99%

Characterization of Thick Film of Copper Electrodeposited for Cryogenic Applications

Fava

Lucci

Faso³

et al. 2014

J. Electrochem. Soc.

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Inverse Hall-Petch Behavior in Nanocrystalline Aluminum Using Molecular Dynamics

2023

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This work investigates the mechanical behavior of nanocrystalline aluminum, with special focus on deformation mechanisms, using molecular dynamics simulations with an interatomic potential parameterized by the authors. To this end, four nanocrystalline samples with grain sizes ranging from 8,2 to 14,2 nm were constructed, each with a volume of 15 x 15 x 20 nm3. As expected, the data from the tensile tests at a strain rate of 1,0 x 109 s−1 showed an inverse Hall-Petch relationship. The work hardening behavior revealed no significant gain in mechanical strength. The dislocation analysis indicated that perfect dislocation density decreases during tensile testing, while the Shockley partials increase. Grain boundary-mediated plasticity was evidenced with atomic diffusion along grain boundaries, as well as by grain rotation. Thus, it is concluded that the conventional plastic deformation mechanisms of metals are not preponderant for nanocrystalline aluminum.

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Studying the Hall-Petch effect regarding sub-micrometer steel (0.6% C)

Cited by 2 publications

References 23 publications

Characterization of Thick Film of Copper Electrodeposited for Cryogenic Applications

Characterization of Thick Film of Copper Electrodeposited for Cryogenic Applications

Inverse Hall-Petch Behavior in Nanocrystalline Aluminum Using Molecular Dynamics

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