Study on Welding-Bead Bonding Strength of Laser-Stacking Copper-Aluminum Heterogeneous Electrode Plates

Tsai, Shang-Wu; Chien, Shih-Kai; Chen, Kun-Tso; Tsai, Tsung-Ying; Tseng, Wen-Cheng

doi:10.17265/2159-5275/2021.05.002

JMEA

2021

DOI: 10.17265/2159-5275/2021.05.002

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Study on Welding-Bead Bonding Strength of Laser-Stacking Copper-Aluminum Heterogeneous Electrode Plates

Shang-Wu Tsai¹,

Shih-Kai Chien²,

Kun-Tso Chen³

et al.

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Study on Welding-Bead Bonding Strength of Laser-Stacking Copper-Aluminum Heterogeneous Electrode Plates

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