Study on thermal field coupling simulation of methane sensor based on ceramic micro-hot plate

Shen, Bin; Cao, Shengwu; Yang, Peiqing; Liu, Xinlei

doi:10.1088/1757-899x/490/2/022007

IOP Conf. Ser.: Mater. Sci. Eng.

2019

DOI: 10.1088/1757-899x/490/2/022007

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Study on thermal field coupling simulation of methane sensor based on ceramic micro-hot plate

Bin Shen

Shengwu Cao

Peiqing Yang

et al.

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Cited by 2 publications

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“…Etching thermal isolation through-holes around the heating area reduces thermal conduction between heating units, while wider grooves help minimize thermal crosstalk. [20][21][22] Existing studies have focused on sensor array unit spacings within the range of hundreds of micrometers. Limited research addresses thermal crosstalk issues in sensor arrays with densely packed spacings, in the range of tens of micrometers or even smaller.…”

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confidence: 99%

A two-stage insulation method for suppressing thermal crosstalk in microarray sensitive units

Zhu,

Li,

Luo

et al. 2024

Appl. Phys. Express

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Thermal crosstalk between array structures is a key factor limiting the sensitivity of micro-nano array sensors. We propose a two-stage thermally isolated structure with thermal holes and heat dissipation layer and pulsed voltage heating to reduce thermal crosstalk. Through finite element thermal simulation analysis as well as thermal interference test, the results show that the thermal crosstalk of the two-stage structure is reduced by 12.89% and 39.67%, respectively, in the steady state compared with the structure with no thermal isolation, and the pulsed voltage heating leads to the thermal crosstalk of the two-stage structure to be <10%.

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mentioning

confidence: 99%

A two-stage insulation method for suppressing thermal crosstalk in microarray sensitive units

Zhu,

Li,

Luo

et al. 2024

Appl. Phys. Express

View full text Add to dashboard Cite

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Simulation and Optimization of a Planar-Type Micro-Hotplate with Si3N4-SiO2 Transverse Composite Dielectric Layer and Annular Heater

Wei

Wang

et al. 2022

Micromachines

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Micro-hotplates (MHPs) have become widely used basic structures in many micro sensors and actuators. Based on the analysis of the general heat transfer model, we propose a new MHP design based on a transversal composite dielectric layer, consisting of different heat transfer materials. Two general proven materials with different thermal conductivity, Si3N4 and SiO2, are chosen to form the composite dielectric layer. An annular heater is designed with a plurality of concentric rings connected with each other. The relationship between MHP performance and its geometrical parameters, including temperature distribution and uniformity, thermal deformation, and power dissipation, has been fully investigated using COMSOL simulation. The results demonstrate that the new planar MHP of 2 μm thick with a Si3N4-SiO2 composite dielectric layer and annular heater can reach 300 °C at a power of 35.2 mW with a mechanical deformation of 0.132 μm, at a large heating area of about 0.5 mm2. The introduction of the composite dielectric layer effectively reduces the lateral heat conduction loss and alleviates the mechanical deformation of the planar MHP compared with a single SiO2 dielectric layer or Si3N4 dielectric layer.

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Study on thermal field coupling simulation of methane sensor based on ceramic micro-hot plate

Cited by 2 publications

References 4 publications

A two-stage insulation method for suppressing thermal crosstalk in microarray sensitive units

A two-stage insulation method for suppressing thermal crosstalk in microarray sensitive units

Simulation and Optimization of a Planar-Type Micro-Hotplate with Si3N4-SiO2 Transverse Composite Dielectric Layer and Annular Heater

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