Study on the transparency of polymer materials in case of Nd:YAG laser radiation

Abstract

The exact knowledge of laser-polymer interaction and polymer behaviour is a fundamental requirement to establish good joint quality in the case of transparent-absorbent joining. In the course of this study, the authors investigated the effect of different material properties and laser settings, like thickness, additives, laser power and pulse characteristics, on the transparency in the case of poly(methyl methacrylate) and polypropylene materials. A new method was developed to detect the limits of material tolerance, which can be the basis of further research on polymer-polymer and polymer-metal hybrid joints.

Investigation of Laser-material Interaction in Case of Aluminium Brazing Process

“…The authors have more research experience in the field laser-material interactions. Not only in case of metals but also in case of polymers (Markovits et al, 2014). As in our earlier investigation, it became clear the applied brazing flux has a high impact on the efficiency of the laser heating.…”

Influencing the Mechanical Properties of Engine and Vehicle Constructions Alloy with Laser Surface Heating

“…1) which is used to reduce wear and improve fatigue resistance of products especially where hard surface layers are required on tough and possibly cheap base materials and where no measurable thermal distortion is allowed. At nowadays, there are three major types of laser sources: CO 2 lasers; Nd: YAG lasers; and excimer lasers (Tillová et al, 2017;Montealegre et al, 2010;Parker, 2010;Bauernhuber et al, 2016;Markovits et al, 2013). The fundamental problem in surface heating substances by laser radiation is well defined conditions of heating.…”

Improving printing process in reflow and thick film technology through analysis and modeling of paste rheology

“…This is a critical step in the mass assembly of electrical components (KRAMMER, 2014). As the electronic components, lead sizes and the contact surface areas (pad) on printed wiring boards or substrates continuously decrease, the size of stencil apertures became smaller which really challenges the printing process (MARKOVITS, BAUERNHUBER, MIKULA, 2013, HORVATH, 2008.…”