Study on the solid-solid interfacial reaction behavior of solder micro bump prepared by laser assisted bonding

Wu, Yang; Chen, L.D.; Hu, J. W.; Zhang, Z.J.; Huang, Mingliang; Yao, Huang; Li, Bixiong; Zhou, Xu

doi:10.1109/icept56209.2022.9873234

2022 23rd International Conference on Electronic Packaging Technology (ICEPT) 2022

DOI: 10.1109/icept56209.2022.9873234

|View full text |Cite

Study on the solid-solid interfacial reaction behavior of solder micro bump prepared by laser assisted bonding

Yang Wu¹,

L.D. Chen²,

J. W. Hu³

et al.

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...

Citation Types

Supporting

Mentioning

Contrasting

Year Published

2024

Publication Types

Select...

Article1

Relationship

Self Cite0

Independent1

Authors

Journals

Cited by 1 publication

References 5 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

Brittle Fracture Behavior of Sn-Ag-Cu Solder Joints with Ni-Less Surface Finish via Laser-Assisted Bonding

Han,

Lee

et al. 2024

Materials

View full text Add to dashboard Cite

In this study, we investigated the brittle fracture behavior of Sn-3.0Ag-0.5Cu (SAC305) solder joints with a Direct Electroless Gold (DEG) surface finish, formed using laser-assisted bonding (LAB) and mass reflow (MR) techniques. Commercial SAC305 solder balls were used to ensure consistency. LAB increases void fractions and coarsens the primary β-Sn phase with higher laser power, resulting in a larger eutectic network area fraction. In contrast, MR produces solder joints with minimal voids and a thicker intermetallic compound (IMC) layer. LAB-formed joints exhibit higher high-speed shear strength and lower brittle fracture rates compared to MR. The key factor in the reduced brittle fracture in LAB joints is the thinner IMC layer at the joint interface. This study highlights the potential of LAB in enhancing the mechanical reliability of solder joints in advanced electronic packaging applications.

show abstract

Brittle Fracture Behavior of Sn-Ag-Cu Solder Joints with Ni-Less Surface Finish via Laser-Assisted Bonding

Han,

Lee

et al. 2024

Materials

View full text Add to dashboard Cite

show abstract

scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.

Contact Info

hi@scite.ai

10624 S. Eastern Ave., Ste. A-614

Henderson, NV 89052, USA

Blog Terms and Conditions API Terms Privacy Policy Contact Cookie Preferences Do Not Sell or Share My Personal Information

Made with 💙 for researchers

Part of the Research Solutions Family.

Study on the solid-solid interfacial reaction behavior of solder micro bump prepared by laser assisted bonding

Cited by 1 publication

References 5 publications

Brittle Fracture Behavior of Sn-Ag-Cu Solder Joints with Ni-Less Surface Finish via Laser-Assisted Bonding

Brittle Fracture Behavior of Sn-Ag-Cu Solder Joints with Ni-Less Surface Finish via Laser-Assisted Bonding

Contact Info

Product

Resources

About