Study on the replication accuracy of polymer hot embossed microchannels

Optimization of hot embossing molding process parameters of Fresnel lens using Taguchi method

“…This shows that the hot embossing temperature is the most significant factor affecting the transcription rate of the embossed parts. This result was in good agreement with results of other investigations [17,18]. Figure 7 shows Fresnel lenses fabricated by the conventional hot embossing molding process parameters and optimal hot embossing molding process parameters [24].…”

“…The replication fidelity of the fabricated hot embossing tool is about 98%. The proposed method for fabricating hot embossing tool seems to be fast and simple as compared to methods of X-ray lithography and LIGA like because the proposed method requires no any state-of-the-art facilities or special skills [16,17].…”

Rapid fabrication of microstructure on PMMA substrate by the plate to plate Transition‐Spanning isothermal hot embossing method nearby glass transition temperature

“…The main problem influencing accurate replication and processing efficiency for traditional hot embossing includes volume shrinkage of the polymer caused by solidification, sticking surface of the mold and long cycle time. Aimed at improving the precision and efficiency of the hot embossing, the embossing window was being extended to lower temperature down to 15–20°C above T g , addressing it as the extend‐hot embossing for the convenience of comparison, as shown in Fig. , where the polymer already falls into the entropy elastic range and the displacement element becomes segments of macromolecular, which may cause high elastic strain up to 100–1000%.…”

Embossing Process

“…As a relatively mature technology, P2P hot embossing is widely used for industrial production, such as the compact disc (CD) and digital versatile disc (DVD). Firstly, the effects of embossing temperature, load, and holding time on the filling behavior have been widely investigated (Lee, Kang, & Youn, 2010;Lin et al, 2013;Singh & Dupaix, 2012). The filling and demolding process during P2P hot embossing remains the focus of research, which have been investigated experimentally and numerically.…”